<div class="csl-bib-body">
<div class="csl-entry">Filipovic, L. (2022). Reliability of Platinum Microheater Geometries for MEMS-Based Gas Sensors. In <i>2022 IEEE International Integrated Reliability Workshop (IIRW)</i> (pp. 1–6). IEEE. https://doi.org/10.1109/IIRW56459.2022.10032744</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/177706
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dc.description.abstract
We model the electromigration (EM)- and thermo-migration (TM)-induced stress build-up in MEMS microheaters based on platinum spiral geometries in order to study the impact of several design decisions, including the film thickness, the rounding of sharp corners, and the introduction of a heatspreading plate. We observed that the TM-induced stress is dominant and found that reducing the film thickness results in a direct increase in the EM stress; however, the TM stress did not vary significantly even though the temperature uniformity was degraded. Rounding the sharp corners in the spiral geometry was shown to be beneficial in reducing the stress, with a direct correlation between increasing corner radius and reducing the induced stress. Furthermore, many microheater designs include a heat-spreading plate in order to improve the temperature uniformity across the microheater. In this study, we show that, while the heat-spreading plate has the desired effect, it comes at a cost of a significant increase in the power consumption (+70%) and in the EM- and TM-induced stress (+100%).
en
dc.description.sponsorship
FFG - Österr. Forschungsförderungs- gesellschaft mbH; Global TCAD Solutions GmbH
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dc.language.iso
en
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dc.subject
Thermo-migration
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dc.subject
Electromigration
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dc.subject
Platinum
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dc.subject
Microheater
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dc.subject
MEMS membrane
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dc.subject
Gas sensor
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dc.title
Reliability of Platinum Microheater Geometries for MEMS-Based Gas Sensors
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.relation.isbn
978-1-6654-5368-4
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dc.relation.doi
https://doi.org/10.1109/IIRW56459.2022
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dc.description.startpage
1
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dc.description.endpage
6
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dc.relation.grantno
Not yet assigned
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dc.type.category
Full-Paper Contribution
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tuw.booktitle
2022 IEEE International Integrated Reliability Workshop (IIRW)
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tuw.relation.publisher
IEEE
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tuw.relation.publisherplace
Piscataway
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tuw.project.title
Prozessabhängige Struktur-Emulation als Kooptimierungsstrategie für die Bauelementetechnologie
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tuw.researchTopic.id
Q4
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tuw.researchTopic.id
C6
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tuw.researchTopic.id
C1
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tuw.researchTopic.name
Nanoelectronics
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tuw.researchTopic.name
Modeling and Simulation
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tuw.researchTopic.name
Computational Materials Science
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tuw.researchTopic.value
10
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tuw.researchTopic.value
65
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tuw.researchTopic.value
25
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tuw.publication.orgunit
E360 - Institut für Mikroelektronik
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tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
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tuw.publisher.doi
10.1109/IIRW56459.2022.10032744
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dc.description.numberOfPages
6
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tuw.author.orcid
0000-0003-1687-5058
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tuw.event.name
IEEE International Integrated Reliability Workshop (IIRW)