<div class="csl-bib-body">
<div class="csl-entry">Ertl, M. C., Jaidl, M., Limbacher, B., Theiner, D., Giparakis, M., Beiser, M., Andrews, A. M., Strasser, G., Darmo, J., & Unterrainer, K. (2023). Spectral Shaping In Ultra-Thin Terahertz Quantum Cascade Laser Pairs. In <i>2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)</i>. 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz 2023), Montreal, Quebec, Canada. IEEE. https://doi.org/10.1109/IRMMW-THz57677.2023.10299208</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/189845
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dc.description.abstract
We present optically coupled episide down bonded ultra-thin terahertz quantum cascade wire laser pairs. Episide down flip chip bonding facilitates the electrical contacting of ultra-thin lasers. The resulting sandwich structure traps the radiation propagating outside the laser cavities. In subwavelength laser cavities up to half of the mode propagates along the outside. This radiation couples to the neighboring ridges which injection-locks them.
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dc.language.iso
en
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dc.rights.uri
http://rightsstatements.org/vocab/InC/1.0/
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dc.subject
terahertz
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dc.subject
quantum cascade laser
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dc.subject
flip chip bonding
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dc.subject
wire laser
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dc.subject
aser array
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dc.subject
semiconductor lasers
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dc.subject
contacts
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dc.subject
wires
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dc.subject
optical propagation
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dc.subject
Laser modes
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dc.subject
optical coupling
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dc.subject
Flip-chip devices
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dc.title
Spectral Shaping In Ultra-Thin Terahertz Quantum Cascade Laser Pairs
