<div class="csl-bib-body">
<div class="csl-entry">Leva, F., Corna, A., Werginz, P., Palestri, P., Zeck, G. M., & Selmi, L. (2023). Identification of Axon Bendings in Neurons by Multiphysics FEM Simulations of High-Density MEA Extracellular Recordings. In <i>2023 IEEE SENSORS</i> (pp. 1–4). IEEE. https://doi.org/10.1109/SENSORS56945.2023.10325212</div>
</div>
-
dc.identifier.uri
http://hdl.handle.net/20.500.12708/190881
-
dc.description.abstract
A three-dimensional finite element method (FEM) simulation of a neuron (retinal ganglion cell) interfaced to a high-density CMOS-based microelectrode array (MEA) is performed and compared to recordings. The adopted multiscale simulation approach accurately reproduces the signals recorded by the patch clamp and the MEA sensors. The simulation leads us to identify bendings of the axon initial segment of a few neurons embedded in tissue, which are reported here for the first time.
en
dc.language.iso
en
-
dc.subject
Axons
en
dc.subject
Microelectrodes
en
dc.subject
Neurons
en
dc.subject
Bending
en
dc.subject
Retina
en
dc.subject
Sensors
en
dc.subject
Finite element analysis
en
dc.title
Identification of Axon Bendings in Neurons by Multiphysics FEM Simulations of High-Density MEA Extracellular Recordings
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.contributor.affiliation
University of Modena and Reggio Emilia, Italy
-
dc.contributor.affiliation
University of Udine, Italy
-
dc.contributor.affiliation
University of Modena and Reggio Emilia, Italy
-
dc.relation.isbn
979-8-3503-0387-2
-
dc.relation.issn
1930-0395
-
dc.description.startpage
1
-
dc.description.endpage
4
-
dc.type.category
Full-Paper Contribution
-
dc.relation.eissn
2168-9229
-
tuw.booktitle
2023 IEEE SENSORS
-
tuw.relation.publisher
IEEE
-
tuw.relation.publisherplace
Piscataway
-
tuw.researchTopic.id
X1
-
tuw.researchTopic.name
Beyond TUW-research foci
-
tuw.researchTopic.value
100
-
tuw.publication.orgunit
E363 - Institut für Biomedizinische Elektronik
-
tuw.publication.orgunit
E101-03 - Forschungsbereich Scientific Computing and Modelling
-
tuw.publisher.doi
10.1109/SENSORS56945.2023.10325212
-
dc.description.numberOfPages
4
-
tuw.author.orcid
0000-0002-1052-9843
-
tuw.author.orcid
0000-0002-3441-3167
-
tuw.author.orcid
0000-0003-3998-9883
-
tuw.event.name
2023 IEEE SENSORS
en
tuw.event.startdate
29-10-2023
-
tuw.event.enddate
01-11-2023
-
tuw.event.online
On Site
-
tuw.event.type
Event for scientific audience
-
tuw.event.place
VIenna
-
tuw.event.country
AT
-
tuw.event.presenter
Leva, Federico
-
wb.sciencebranch
Sonstige Medizinisch-theoretische Wissenschaften
-
wb.sciencebranch
Neurowissenschaften
-
wb.sciencebranch
Elektrotechnik, Elektronik, Informationstechnik
-
wb.sciencebranch.oefos
3019
-
wb.sciencebranch.oefos
3014
-
wb.sciencebranch.oefos
2020
-
wb.sciencebranch.value
30
-
wb.sciencebranch.value
50
-
wb.sciencebranch.value
20
-
item.grantfulltext
none
-
item.openairetype
conference paper
-
item.fulltext
no Fulltext
-
item.languageiso639-1
en
-
item.openairecristype
http://purl.org/coar/resource_type/c_5794
-
item.cerifentitytype
Publications
-
crisitem.author.dept
University of Modena and Reggio Emilia, Italy
-
crisitem.author.dept
E363 - Institut für Biomedizinische Elektronik
-
crisitem.author.dept
E363 - Institut für Biomedizinische Elektronik
-
crisitem.author.dept
E363 - Institut für Biomedizinische Elektronik
-
crisitem.author.orcid
0000-0002-1052-9843
-
crisitem.author.orcid
0000-0002-3441-3167
-
crisitem.author.orcid
0000-0003-3998-9883
-
crisitem.author.parentorg
E350 - Fakultät für Elektrotechnik und Informationstechnik
-
crisitem.author.parentorg
E350 - Fakultät für Elektrotechnik und Informationstechnik
-
crisitem.author.parentorg
E350 - Fakultät für Elektrotechnik und Informationstechnik