<div class="csl-bib-body">
<div class="csl-entry">Piacentini, A., Polyushkin, D., Uzlu, B., Grundmann, A., Heuken, D. M., Kalisch, H., Vescan, A., Müller, T., Lemme, M. C., & Neumaier, D. (2023). Flexible CMOS electronics based on 2D p-type WSe₂ and n-type MoS₂. In <i>2023 Device Research Conference (DRC)</i> (pp. 1–2). IEEE. https://doi.org/10.1109/DRC58590.2023.10187050</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/191093
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dc.description.abstract
Flexible electronics have been emerging in the last years for a wide variety of applications. In this scenario, transition metal dichalcogenides (TMDCs), such as molybdenum disulfide (MOS2) and tungsten diselenide (WSe2), have captured increased attention because of their complementary transport properties, and their excellent mechanical flexibility [1]. In particular, MOS2 has shown good electron transport, while WSe2 has predominantly shown hole transport [2]. This enables complementary metal-oxide semiconductor (CMOS) technology with its inherent advantages over its unipolar counterpart, i.e., low power dissipation and large noise immunity. Here, we demonstrate n-type MOS2 and p-type WSe2 field effect transistors (FETs) and combine them to form CMOS inverters on a flexible polyimide (PI) substrate.
en
dc.language.iso
en
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dc.subject
Power demand
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dc.subject
Field effect transistors
en
dc.subject
Polyimides
en
dc.subject
Inverters
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dc.subject
Power dissipation
en
dc.title
Flexible CMOS electronics based on 2D p-type WSe₂ and n-type MoS₂
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.relation.publication
2023 Device Research Conference (DRC)
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dc.contributor.affiliation
AMO (Germany), Germany
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dc.contributor.affiliation
AMO (Germany), Germany
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dc.contributor.affiliation
Aixtron (Germany), Germany
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dc.contributor.affiliation
RWTH Aachen University, Germany
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dc.contributor.affiliation
RWTH Aachen University, Germany
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dc.contributor.affiliation
AMO (Germany), Germany
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dc.contributor.affiliation
AMO (Germany), Germany
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dc.relation.isbn
9798350323108
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dc.relation.doi
10.1109/DRC58590.2023
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dc.relation.issn
1548-3770
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dc.description.startpage
1
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dc.description.endpage
2
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dc.type.category
Full-Paper Contribution
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dc.relation.eissn
2640-6853
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tuw.booktitle
2023 Device Research Conference (DRC)
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tuw.relation.publisher
IEEE
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tuw.researchTopic.id
M2
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tuw.researchTopic.id
I7
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tuw.researchTopic.id
Q1
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tuw.researchTopic.name
Materials Characterization
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tuw.researchTopic.name
Telecommunication
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tuw.researchTopic.name
Photonics
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tuw.researchTopic.value
15
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tuw.researchTopic.value
15
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tuw.researchTopic.value
70
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tuw.publication.orgunit
E387-01 - Forschungsbereich Photonik
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tuw.publication.orgunit
E056-04 - Fachbereich TU-DX: Towards Applications of 2D Materials