<div class="csl-bib-body">
<div class="csl-entry">Wodak, I., Yakymovych, A., & Khatibi, G. (2023). Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux. In <i>2023 46th International Spring Seminar on Electronics Technology (ISSE)</i> (pp. 1–4). IEEE. https://doi.org/10.1109/ISSE57496.2023.10168365</div>
</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/191272
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dc.description.abstract
In this research, the impact of Fe nanoparticles (NPs) addition on the microstructure and mechanical properties of Sn-3.5Ag solder joints was investigated. As opposed to the more pronounced approach of adding NPs directly to the solder paste, varying concentrations of nanoparticles (0.0 - 2.0 wt.%) were mixed with the flux to increase their concentration at the interface and to control the formation and growth of intermetallic compound layers (IMCs) in more effective way. The solder joints were subjected to thermal treatment at different temperatures and durations, and the growth rate of the IMCs in the as-reflowed and aged samples was examined. It was found that the application of Fe-NPs doped flux led to an increase in the shear strength of the solder joints. This improvement could be attributed to the reduction in the growth rate of brittle intermetallic phases as well as refinement of the microstructure.
en
dc.description.sponsorship
FWF - Österr. Wissenschaftsfonds
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dc.language.iso
en
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dc.subject
Fe Nanoparticles
en
dc.subject
Hybrid Solder Joint
en
dc.subject
Intermetallic compound
en
dc.subject
Morphology
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dc.subject
Shear strength
en
dc.title
Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.relation.isbn
9798350334845
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dc.relation.issn
2161-2528
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dc.description.startpage
1
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dc.description.endpage
4
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dc.relation.grantno
P 34894-N
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dc.type.category
Full-Paper Contribution
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dc.relation.eissn
2161-2536
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tuw.booktitle
2023 46th International Spring Seminar on Electronics Technology (ISSE)
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tuw.relation.publisher
IEEE
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tuw.relation.publisherplace
Piscataway
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tuw.project.title
Hybrid-Lötstellen - neue vielversprechende Lötstrategie
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tuw.researchTopic.id
M1
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tuw.researchTopic.id
M8
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tuw.researchTopic.name
Surfaces and Interfaces
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tuw.researchTopic.name
Structure-Property Relationsship
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tuw.researchTopic.value
50
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tuw.researchTopic.value
50
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tuw.publication.orgunit
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
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tuw.publisher.doi
10.1109/ISSE57496.2023.10168365
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dc.description.numberOfPages
4
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tuw.author.orcid
0000-0002-2884-9984
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tuw.event.name
2023 46th International Spring Seminar on Electronics Technology (ISSE)
en
tuw.event.startdate
10-05-2023
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tuw.event.enddate
14-05-2023
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tuw.event.online
On Site
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tuw.event.type
Event for scientific audience
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tuw.event.place
Timisoara
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tuw.event.country
RO
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tuw.event.presenter
Wodak, Irina
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tuw.event.track
Multi Track
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wb.sciencebranch
Chemie
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wb.sciencebranch.oefos
1040
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wb.sciencebranch.value
100
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item.cerifentitytype
Publications
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item.openairetype
conference paper
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item.languageiso639-1
en
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item.openairecristype
http://purl.org/coar/resource_type/c_5794
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item.fulltext
no Fulltext
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item.grantfulltext
none
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crisitem.project.funder
FWF - Österr. Wissenschaftsfonds
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crisitem.project.grantno
P 34894-N
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit