<div class="csl-bib-body">
<div class="csl-entry">Leroch, S., Stella, R., Hössinger, A., & Filipovic, L. (2023). Molecular Dynamics Study of Al Implantation in 4H-SiC. In <i>2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)</i> (pp. 185–188). IEEE. https://doi.org/10.23919/SISPAD57422.2023.10319554</div>
</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/192890
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dc.description.abstract
We have performed a molecular dynamics study of Al-implantation in 4H-SiC while investigating the types of defects produced and their quantity depending on the implantation temperature and dose. The damage to the SiC lattice should be minimized to facilitate the subsequent Al activation during annealing. Using the empirical Gao-Weber potential, together with a recently proposed Morse potential for the Al-SiC interaction, we show that implantation at elevated temperatures considerably reduces the creation of amorphous pockets and extended defect clusters. In a follow-up annealing study we aim to provide a correlation between dose/implantation temperature and the Al activation rate to give guidance for future fabrication of SiC devices.
en
dc.description.sponsorship
Christian Doppler Forschungsgesells
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dc.language.iso
en
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dc.subject
4H-SiC
en
dc.subject
Gao-Weber potential
en
dc.subject
Al-implantation
en
dc.subject
formation energies of Al in SiC
en
dc.subject
high-temperature implantation
en
dc.title
Molecular Dynamics Study of Al Implantation in 4H-SiC
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.relation.publication
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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dc.contributor.affiliation
TU Wien, Austria
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dc.contributor.affiliation
Silvaco (United Kingdom), United Kingdom of Great Britain and Northern Ireland (the)
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dc.relation.isbn
978-4-86348-803-8
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dc.relation.doi
10.23919/SISPAD57422.2023
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dc.description.startpage
185
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dc.description.endpage
188
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dc.relation.grantno
00000
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dc.type.category
Full-Paper Contribution
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tuw.booktitle
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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tuw.relation.publisher
IEEE
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tuw.project.title
Multi-Scale-Prozessmodellierung von Halbleiter-Bauelemente und -Sensoren
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tuw.researchTopic.id
Q4
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tuw.researchTopic.id
C6
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tuw.researchTopic.name
Nanoelectronics
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tuw.researchTopic.name
Modeling and Simulation
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tuw.researchTopic.value
30
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tuw.researchTopic.value
70
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tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
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tuw.publisher.doi
10.23919/SISPAD57422.2023.10319554
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dc.description.numberOfPages
4
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tuw.author.orcid
0000-0002-7787-4385
-
tuw.author.orcid
0000-0003-1687-5058
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tuw.event.name
2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
en
tuw.event.startdate
27-09-2023
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tuw.event.enddate
29-09-2023
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tuw.event.online
On Site
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tuw.event.type
Event for scientific audience
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tuw.event.place
Kobe
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tuw.event.country
JP
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tuw.event.presenter
Stella, Robert
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wb.sciencebranch
Elektrotechnik, Elektronik, Informationstechnik
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wb.sciencebranch.oefos
2020
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wb.sciencebranch.value
100
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item.grantfulltext
restricted
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item.fulltext
no Fulltext
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item.openairecristype
http://purl.org/coar/resource_type/c_5794
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item.languageiso639-1
en
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item.cerifentitytype
Publications
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item.openairetype
conference paper
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crisitem.author.dept
E360-01 - Forschungsbereich Mikroelektronik
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crisitem.author.dept
TU Wien
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crisitem.author.dept
E360 - Institut für Mikroelektronik
-
crisitem.author.dept
E360-01 - Forschungsbereich Mikroelektronik
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crisitem.author.orcid
0000-0002-7787-4385
-
crisitem.author.orcid
0000-0003-1687-5058
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crisitem.author.parentorg
E360 - Institut für Mikroelektronik
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crisitem.author.parentorg
E350 - Fakultät für Elektrotechnik und Informationstechnik