<div class="csl-bib-body">
<div class="csl-entry">Lederer, M., Betzwar Kotas, A. M., & Khatibi Damavandi, G. (2020). A lifetime assessment and prediction method for large area solder joints. <i>Microelectronics Reliability</i>, <i>114</i>, 1–7. https://doi.org/10.1016/j.microrel.2020.113888</div>
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dc.identifier.issn
0026-2714
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/20346
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dc.description.abstract
Mechanical bending fatigue experiments were conducted on large area Pb-rich and SnSb-based model solder joints consisting of Cu-strip/solder/DCB substrates. Experimental lifetime curves in the range between 105 and 108 loading cycles at room and elevated temperature showed an improved fatigue resistance for SnSb alloys. Crack length as a function of loading cycles (da/dN) was determined for selected samples to study the cyclic degradation behaviour of the solder layer. Crack initiation and propagation in the joints was modelled on the basis of a damage accumulation rule considering the strain rate and temperature dependency of the solder alloy. Application of the FEM model to large area solder joints allowed calculation of the incremental advancement of the crack front, determination of the crack growth rate (da/dN) and prediction of lifetime under a given loading condition.
en
dc.language.iso
en
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dc.publisher
PERGAMON-ELSEVIER SCIENCE LTD
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dc.relation.ispartof
Microelectronics Reliability
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dc.rights.uri
http://creativecommons.org/licenses/by-nc-nd/4.0/
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dc.subject
solder joint
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dc.title
A lifetime assessment and prediction method for large area solder joints
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dc.type
Article
en
dc.type
Artikel
de
dc.rights.license
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International
en
dc.rights.license
Creative Commons Namensnennung - Nicht kommerziell - Keine Bearbeitungen 4.0 International