<div class="csl-bib-body">
<div class="csl-entry">Moll, P., Pfusterschmied, G., & Schmid, U. (2024). Impact of Excess Carbon at the 3C-SiC/SiO₂ Interface Using LPCVD-Based Alternating Supply Deposition. In IEEE Xplore (Ed.), <i>Proceedings of the 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)</i> (pp. 606–609). IEEE. https://doi.org/10.1109/MEMS58180.2024.10439413</div>
</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/209842
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dc.description.abstract
We present for the first time alternative supply deposition (ASD) for the synthetization of polycrystalline 3C-SiC on Si/SiO2 substrates, thus representing an alternative route to silicon carbide on insulator (SiCOI). For this purpose, we investigated the differences in microstructure and electrical performance depending on whether a carbonization step (CS) is included or not. In comparison to 3C-SiC thin films deposited on pure Si with the same parameters we found an inhibited growth per cycle of 37 % on SiO2. For thin films grown on SiO2 without a CS we measured film resistivity values of ~6600 Ω·cm being four orders of magnitude higher, than those with a CS. High-resolution TEM images of the 3C-SiC/Si interface revealed the presence of an amorphous carbon layer, decreasing the overall 3C-SiC film resistivity.
en
dc.language.iso
en
-
dc.subject
3C-SiC
en
dc.subject
Carbonization step
en
dc.subject
Film resistivity
en
dc.subject
LPCVD
en
dc.subject
SiO -interface 2
en
dc.title
Impact of Excess Carbon at the 3C-SiC/SiO₂ Interface Using LPCVD-Based Alternating Supply Deposition
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.relation.isbn
979-8-3503-5792-9
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dc.relation.doi
10.1109/MEMS58180.2024
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dc.description.startpage
606
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dc.description.endpage
609
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dc.type.category
Full-Paper Contribution
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tuw.booktitle
Proceedings of the 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)
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tuw.peerreviewed
true
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tuw.relation.publisher
IEEE
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tuw.researchTopic.id
M2
-
tuw.researchTopic.id
I8
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tuw.researchTopic.name
Materials Characterization
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tuw.researchTopic.name
Sensor Systems
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tuw.researchTopic.value
50
-
tuw.researchTopic.value
50
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tuw.publication.orgunit
E366-02 - Forschungsbereich Mikrosystemtechnik
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tuw.publisher.doi
10.1109/MEMS58180.2024.10439413
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dc.description.numberOfPages
4
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tuw.event.name
2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS)
en
tuw.event.startdate
21-01-2024
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tuw.event.enddate
25-01-2024
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tuw.event.online
On Site
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tuw.event.type
Event for scientific audience
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tuw.event.place
Austin
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tuw.event.country
US
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tuw.event.presenter
Moll, Philipp
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wb.sciencebranch
Elektrotechnik, Elektronik, Informationstechnik
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wb.sciencebranch.oefos
2020
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wb.sciencebranch.value
100
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dc.contributor.editorgroup
IEEE Xplore
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item.languageiso639-1
en
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item.openairetype
conference paper
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item.grantfulltext
restricted
-
item.fulltext
no Fulltext
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item.cerifentitytype
Publications
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item.openairecristype
http://purl.org/coar/resource_type/c_5794
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crisitem.author.dept
E366-02 - Forschungsbereich Mikrosystemtechnik
-
crisitem.author.dept
E366-02 - Forschungsbereich Mikrosystemtechnik
-
crisitem.author.dept
E366 - Institut für Sensor- und Aktuatorsysteme
-
crisitem.author.parentorg
E366 - Institut für Sensor- und Aktuatorsysteme
-
crisitem.author.parentorg
E366 - Institut für Sensor- und Aktuatorsysteme
-
crisitem.author.parentorg
E350 - Fakultät für Elektrotechnik und Informationstechnik