Towards Fabrication of Next-Generation Physical Sensors Through Integrating Suspended Sub-Micron Silicon Nanowires with Microelectromechanical Systems

Abstract

Silicon nanowires possess superior mechanical, electrical, and optical properties, making them ideal for next-generation sensors. This study presents a scalable technology for monolithic fabrication of sub-micron silicon nanowires with microelectromechanical systems, achieving integration of suspended sub-micron silicon nanowires within microelectromechanical systems up to 80 µm thick on Si substrates, with high yield and repeatability. The technological approach is validated on silicon-on-insulator substrates, followed by electromechanical characterization via electrical probe measurements and vibrational testing for performance validation. The presented technology is promising for the potential development of next-generation high-performance physical sensors such as accelerometers and gyroscopes.