<div class="csl-bib-body">
<div class="csl-entry">Wodak, I., Khodabakhshi, F., Yakymovych, A., & Khatibi Damavandi, G. (2023). Microstructural Features and Crystallographic Texture of Sn3.5Ag Solder Joints Produced with Fe-Nanoparticle Doped Flux*. In Institute of Electrical and Electronics Engineers Inc. (Ed.), <i>2023 IEEE Nanotechnology Materials and Devices Conference (NMDC)</i> (pp. 711–716). https://doi.org/10.1109/NMDC57951.2023.10343630</div>
</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/211725
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dc.description.abstract
This study concerns the effect of Fe nanoparticles (NPs) addition on the structure and performance of Sn3.5Ag solder joints. Alternative to the commonly used strategy of mixing nanoparticles with the solder, various amounts (0.0-2wt%) of Fe-NPs were added to the flux. Solder joints were then prepared by placing the NP-doped flux between the Sn-based solder foils and Cu substrates to achieve a proportionally high concentration of the NPs at the interface. The effect of Fe-nanoparticle additions on the formation and growth of interfacial intermetallic compounds (IMCs) and the microstructure of the bulk solder was investigated in as-reflow condition and after thermal aging up to 180°C and 480h. The results showed a reduced growth rate of the interfacial intermetallic phases (IMCs) of the solder joints prepared with NP-doped flux. Detailed structural and chemical analyses revealed the encountered interfacial reactions and dominancy of strong textural components for the Fe-NP-doped Sn-based solder joints.
en
dc.description.sponsorship
FWF - Österr. Wissenschaftsfonds
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dc.language.iso
en
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dc.subject
nanosolders
en
dc.subject
microstrcuture
en
dc.subject
texture
en
dc.subject
intermetallics
en
dc.title
Microstructural Features and Crystallographic Texture of Sn3.5Ag Solder Joints Produced with Fe-Nanoparticle Doped Flux*
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.relation.isbn
979-8-3503-3546-0
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dc.description.startpage
711
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dc.description.endpage
716
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dc.relation.grantno
P 34894-N
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dc.type.category
Full-Paper Contribution
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tuw.booktitle
2023 IEEE Nanotechnology Materials and Devices Conference (NMDC)
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tuw.peerreviewed
true
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tuw.publication.invited
invited
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tuw.project.title
Hybrid-Lötstellen - neue vielversprechende Lötstrategie
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tuw.researchTopic.id
M2
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tuw.researchTopic.id
M1
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tuw.researchTopic.name
Materials Characterization
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tuw.researchTopic.name
Surfaces and Interfaces
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tuw.researchTopic.value
50
-
tuw.researchTopic.value
50
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tuw.publication.orgunit
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
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tuw.publisher.doi
10.1109/NMDC57951.2023.10343630
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dc.description.numberOfPages
6
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tuw.author.orcid
0000-0002-2884-9984
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tuw.event.name
IEEE Nanotechnology Materials and Devices Conference (NMDC 2023)
en
tuw.event.startdate
22-10-2023
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tuw.event.enddate
25-10-2023
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tuw.event.online
On Site
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tuw.event.type
Event for scientific audience
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tuw.event.country
IT
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tuw.event.presenter
Khatibi Damavandi, Golta
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wb.sciencebranch
Chemie
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wb.sciencebranch
Elektrotechnik, Elektronik, Informationstechnik
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wb.sciencebranch.oefos
1040
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wb.sciencebranch.oefos
2020
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wb.sciencebranch.value
80
-
wb.sciencebranch.value
20
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dc.contributor.editorgroup
Institute of Electrical and Electronics Engineers Inc.
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item.languageiso639-1
en
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item.openairetype
conference paper
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item.grantfulltext
none
-
item.fulltext
no Fulltext
-
item.cerifentitytype
Publications
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item.openairecristype
http://purl.org/coar/resource_type/c_5794
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
