<div class="csl-bib-body">
<div class="csl-entry">Filipovic, L., & Reiter, T. (2024). Multi-Scale Model for High Aspect Ratio TiN Etching in a Cl₂/Ar Inductively Coupled Plasma. In <i>SICT 2024, Plasma Tech 2024 and Tribology 2024 Joint International Conferences: Book of Abstracts</i> (pp. 67–67).</div>
</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/212136
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dc.description.sponsorship
Christian Doppler Forschungsgesells
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dc.language.iso
en
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dc.subject
Spline interpolation
en
dc.subject
Plasma reactor surrogate model
en
dc.title
Multi-Scale Model for High Aspect Ratio TiN Etching in a Cl₂/Ar Inductively Coupled Plasma
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.description.startpage
67
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dc.description.endpage
67
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dc.relation.grantno
00000
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dc.type.category
Abstract Book Contribution
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tuw.booktitle
SICT 2024, Plasma Tech 2024 and Tribology 2024 Joint International Conferences: Book of Abstracts
-
tuw.project.title
Multi-Scale-Prozessmodellierung von Halbleiter-Bauelemente und -Sensoren
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tuw.researchTopic.id
I6
-
tuw.researchTopic.id
C6
-
tuw.researchTopic.name
Digital Transformation in Manufacturing
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tuw.researchTopic.name
Modeling and Simulation
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tuw.researchTopic.value
50
-
tuw.researchTopic.value
50
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tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
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tuw.publication.orgunit
E056-04 - Fachbereich TU-DX: Towards Applications of 2D Materials
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dc.description.numberOfPages
1
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tuw.author.orcid
0000-0003-1687-5058
-
tuw.author.orcid
0000-0002-5638-9129
-
tuw.event.name
SICT 2024, Plasma Tech 2024 and Tribology 2024 Joint International Conferences
