<div class="csl-bib-body">
<div class="csl-entry">Gentles, A., Dehghani, M., Minixhofer, R., Khakbaz, P., Waldhor, D., & Waltl, M. (2024). Modeling Next Generation Sensor Chips: Towards Predictive Band Structure Models for Quarternary III-V Semiconductor Alloys. In <i>2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)</i>. 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), United States of America (the). https://doi.org/10.1109/SISPAD62626.2024.10732909</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/212140
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dc.description.abstract
In this work, an ab initio scheme based on the DFT+U method is presented to model the electronic structure of ternary/quaternary semiconductor alloys. Within this method, optimal sets of Hubbard-U parameters are found for each binary compound of the alloy using a Bayesian optimization scheme. We introduce two interpolation schemes for the U parameters to describe the electronic structure in alloy supercells. By applying them on the InGaAsSb semiconductor alloy, we show that the predicted bandgap bowing is much closer to experimental data compared to results based on the virtual crystal approximation. The two schemes are shown to predict almost identical electronic bandgaps and provide a computationally efficient alternative to other approaches like the use of hybrid functionals.
en
dc.language.iso
en
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dc.subject
Density Functional Theory
en
dc.subject
Semiconductor Compounds
en
dc.subject
Quarternary Alloys
en
dc.title
Modeling Next Generation Sensor Chips: Towards Predictive Band Structure Models for Quarternary III-V Semiconductor Alloys
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.contributor.affiliation
Aqua Metrology Systems (United States), United States of America (the)
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dc.contributor.affiliation
AMS (Austria), Austria
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dc.contributor.affiliation
TU Wien, Austria
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dc.type.category
Full-Paper Contribution
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tuw.booktitle
2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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tuw.peerreviewed
true
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tuw.researchTopic.id
C6
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tuw.researchTopic.id
C1
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tuw.researchTopic.name
Modeling and Simulation
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tuw.researchTopic.name
Computational Materials Science
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tuw.researchTopic.value
25
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tuw.researchTopic.value
75
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tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
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tuw.publisher.doi
10.1109/SISPAD62626.2024.10732909
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dc.description.numberOfPages
4
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tuw.author.orcid
0000-0002-7794-1904
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tuw.author.orcid
0000-0002-8631-5681
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tuw.author.orcid
0000-0001-6042-759X
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tuw.event.name
2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)