<div class="csl-bib-body">
<div class="csl-entry">Lenzner, M., Krüger, J., Kautek, W., & Krausz, F. (1999). Precision laser ablation of dielectrics in the 10-fs regime. <i>APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING</i>, <i>68</i>(3), 369–371. https://doi.org/10.1007/s003390050906</div>
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dc.identifier.issn
0947-8396
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/219153
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dc.description.abstract
Laser pulses in the 10-fs domain provide a quality of micromachining of fused silica and borosilicate glass that is unobtainable with longer pulses in the range of several 100 femtoseconds up to picoseconds. The shortening of the pulses reduces the statistical behavior of the material removal and the ablation process thus attains a more deterministic and reproducible character. The improved reproducibility of ablation is accompanied by significantly smoother morphology. This offers the potential for lateral and vertical machining precision of the order of 100 nm and 10 nm, respectively.
en
dc.language.iso
en
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dc.publisher
SPRINGER HEIDELBERG
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dc.relation.ispartof
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
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dc.subject
Ultrafast lasers
en
dc.subject
laser pulses
en
dc.subject
Femtosecond laser
en
dc.title
Precision laser ablation of dielectrics in the 10-fs regime
