<div class="csl-bib-body">
<div class="csl-entry">Saleh, A. S., Croes, K., Ceric, H., De Wolf, I., & Zahedmanesh, H. (2025). AI-driven variability-aware physics-based EM simulation framework for jmax estimation. In <i>2025 IEEE International Interconnect Technology Conference (IITC)</i>. 28th IEEE International Interconnect Technology Conference (IITC 2025), Busan, Korea (the Republic of). IEEE. https://doi.org/10.1109/IITC66087.2025.11075370</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/223580
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dc.description.abstract
A physics-based simulation framework of electromigration in nano-interconnects is presented. By extending our earlier model, that accounted for diffusion heterogeneity among different diffusion paths, the new framework considers metal barrier shunting and accounts for microstructure. The model is strengthened by combining it with a machine learning-based microstructure generator, enabling the incorporation of microstructural variability and its impact on the statistical distribution of EM lifetimes. The framework allows for the estimation of the maximum allowable current density (jmax) for a given technology. As case studies, it is estimated that jmax decreases by ~30% when going from 45 nm to 20 nm linewidth, while reducing the barrier resistivity by half for a fixed thickness causes a 50% increase in void growth time.
en
dc.language.iso
en
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dc.relation.ispartofseries
IEEE International Conference on Interconnect Technology
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dc.subject
Copper
en
dc.subject
Diffusion model
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dc.subject
Electromigration
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dc.subject
Jmax
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dc.subject
Machine learning
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dc.subject
Microstructure
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dc.title
AI-driven variability-aware physics-based EM simulation framework for jmax estimation
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.contributor.affiliation
KU Leuven, Belgium
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dc.contributor.affiliation
IMEC, Belgium
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dc.contributor.affiliation
KU Leuven, Belgium
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dc.contributor.affiliation
KU Leuven, Belgium
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dc.relation.isbn
979-8-3315-3781-4
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dc.relation.doi
10.1109/IITC66087.2025
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dc.relation.issn
2380-632X
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dc.type.category
Full-Paper Contribution
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dc.relation.eissn
2380-6338
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tuw.booktitle
2025 IEEE International Interconnect Technology Conference (IITC)
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tuw.peerreviewed
true
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tuw.relation.publisher
IEEE
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tuw.researchTopic.id
C4
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tuw.researchTopic.id
C6
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tuw.researchTopic.id
C1
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tuw.researchTopic.name
Mathematical and Algorithmic Foundations
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tuw.researchTopic.name
Modeling and Simulation
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tuw.researchTopic.name
Computational Materials Science
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tuw.researchTopic.value
20
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tuw.researchTopic.value
30
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tuw.researchTopic.value
50
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tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
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tuw.publisher.doi
10.1109/IITC66087.2025.11075370
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dc.description.numberOfPages
3
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tuw.event.name
28th IEEE International Interconnect Technology Conference (IITC 2025)