<div class="csl-bib-body">
<div class="csl-entry">Reiter, T., & Filipovic, L. (2025). ViennaPS: A flexible framework for semiconductor process simulation. <i>SoftwareX</i>, <i>32</i>, Article 102453. https://doi.org/10.1016/j.softx.2025.102453</div>
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dc.identifier.issn
2352-7110
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/225854
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dc.description.abstract
ViennaPS is an open-source software framework for simulating fabrication processes in semiconductor manufacturing, with a focus on topography evolution during etching and deposition. It uses a high-performance level-set method with a hierarchical run-length encoding data structure for efficient and fast geometry representation and evolution. ViennaPS supports both analytical and physics-based process models, including Monte Carlo ray tracing for flux calculation at the feature scale. Designed for flexibility and extensibility, it enables users to prototype new models or apply pre-configured ones. ViennaPS provides a customizable platform for researchers and engineers developing advanced process simulations in both academic and industrial settings.
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dc.description.sponsorship
Christian Doppler Forschungsgesells
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dc.language.iso
en
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dc.publisher
ELSEVIER
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dc.relation.ispartof
SoftwareX
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dc.rights.uri
http://creativecommons.org/licenses/by/4.0/
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dc.subject
Plasma etching simulation
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dc.subject
Process simulation
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dc.subject
Topography evolution
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dc.subject
Software framework
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dc.title
ViennaPS: A flexible framework for semiconductor process simulation