<div class="csl-bib-body">
<div class="csl-entry">Waltl, M., Stampfer, B., & Lacerda de Orio, R. (2025). Impact of Charge Trapping at Defects on the Robustness of Electronic Circuits. In <i>2025 9th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)</i>. 9th IEEE Electron Devices Technology & Manufacturing Conference (EDTM 2025), Hong Kong, China. IEEE. https://doi.org/10.1109/EDTM61175.2025.11041458</div>
</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/226323
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dc.description.abstract
Charge trapping at oxide defects is a significant reliability issue in MOS transistors and becomes even more prominent in scaled technology nodes. As devices shrink, the impact of charge capture and emission events of oxide and interface defects on performance becomes more severe. Our work demonstrates how charge trapping affects variability in scaled Silicon and 2D technologies, highlighting the necessity of low trap density to achieve high yield and ensure robust electronic circuit designs.
en
dc.language.iso
en
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dc.relation.ispartofseries
IEEE Electron Devices Technology and Manufacturing Conference (EDTM)
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dc.subject
Charge Trapping
en
dc.subject
Circuit Reliabilty
en
dc.title
Impact of Charge Trapping at Defects on the Robustness of Electronic Circuits
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.type.category
Full-Paper Contribution
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tuw.booktitle
2025 9th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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tuw.peerreviewed
true
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tuw.relation.publisher
IEEE
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tuw.researchTopic.id
M2
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tuw.researchTopic.id
C6
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tuw.researchTopic.name
Materials Characterization
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tuw.researchTopic.name
Modeling and Simulation
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tuw.researchTopic.value
50
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tuw.researchTopic.value
50
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tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
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tuw.publisher.doi
10.1109/EDTM61175.2025.11041458
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dc.description.numberOfPages
3
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tuw.author.orcid
0000-0001-6042-759X
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tuw.author.orcid
0000-0001-5424-7488
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tuw.event.name
9th IEEE Electron Devices Technology & Manufacturing Conference (EDTM 2025)