<div class="csl-bib-body">
<div class="csl-entry">Veryser, B., Stampfl, F. J., Gonzalez-Medina, J. M., Godfrin, C., Raes, B., Wan, D., De Greve, K., Loo, R., Shimura, Y., Panarella, L., Waltl, M., Grill, A., Houssa, M., & Tyaginov, S. (2026). Terman Method to Study Threshold Voltage Hysteresis of Si/SiGe Heterostructures at Cryogenic Temperatures. In <i>2026 IEEE International Reliability Physics Symposium (IRPS)</i>. 2026 IEEE International Reliability Physics Symposium (IRPS), Tucson, AZ, United States of America (the). IEEE. https://doi.org/10.1109/IRPS61424.2026.11499285</div>
</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/229687
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dc.description.abstract
Semiconductor device reliability at cryogenic temperatures has emerged as an important research area driven by quantum computing applications. Si/SiGe heterostructures have established themselves as a leading platform for quantum devices, yet charge trapping at interfaces remains a key reliability concern. This work presents a phenomenological approach to characterize interface trapping in Si/SiGe heterostacks using fixed charge approximations. We demonstrate that threshold voltage hysteresis observed in capacitance-voltage measurements from 4.2 K to 80 K can be accurately modeled by assigning fixed charges at each channel interface. By combining this methodology with the Terman method, we extract the trap energy distribution, revealing a peak located approximately 0.1 eV below the conduction band with a maximum density of 5 × 1012cm-2eV-1. The extracted distributions show strong agreement with interface trap density of states reported in literature, supporting the hypothesis that fast-responding interface traps are the primary mechanism driving the observed hysteresis.
en
dc.language.iso
en
-
dc.subject
Terman method
en
dc.subject
Si/SiGe heterostructures
en
dc.subject
Cryogenic characterization
en
dc.title
Terman Method to Study Threshold Voltage Hysteresis of Si/SiGe Heterostructures at Cryogenic Temperatures
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.relation.publication
2026 IEEE International Reliability Physics Symposium (IRPS)
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dc.contributor.affiliation
reliability - IMEC (Leuven, BE)
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dc.contributor.affiliation
Global TCAD Solutions GmbH (GTS), Vienna, Austria
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dc.contributor.affiliation
imec, Leuven, Belgium
-
dc.contributor.affiliation
imec, Leuven, Belgium
-
dc.contributor.affiliation
imec, Leuven, Belgium
-
dc.contributor.affiliation
KU Leuven, Belgium
-
dc.contributor.affiliation
imec, Leuven, Belgium
-
dc.contributor.affiliation
imec, Leuven, Belgium
-
dc.contributor.affiliation
KU Leuven, Belgium
-
dc.contributor.affiliation
imec, Leuven, Belgium
-
dc.contributor.affiliation
KU Leuven, Belgium
-
dc.contributor.affiliation
imec, Leuven, Belgium
-
dc.relation.isbn
9798331589714
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dc.relation.doi
10.1109/IRPS61424.2026
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dc.relation.issn
1541-7026
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dc.type.category
Full-Paper Contribution
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dc.relation.eissn
1938-1891
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tuw.booktitle
2026 IEEE International Reliability Physics Symposium (IRPS)
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tuw.peerreviewed
true
-
tuw.book.ispartofseries
International Reliability Physics Symposium
-
tuw.relation.publisher
IEEE
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tuw.researchTopic.id
M1
-
tuw.researchTopic.id
Q4
-
tuw.researchTopic.name
Surfaces and Interfaces
-
tuw.researchTopic.name
Nanoelectronics
-
tuw.researchTopic.value
30
-
tuw.researchTopic.value
70
-
tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
-
tuw.publisher.doi
10.1109/IRPS61424.2026.11499285
-
dc.description.numberOfPages
6
-
tuw.author.orcid
0009-0001-2733-3978
-
tuw.author.orcid
0000-0001-6042-759X
-
tuw.author.orcid
0000-0002-5348-2096
-
tuw.event.name
2026 IEEE International Reliability Physics Symposium (IRPS)
-
tuw.event.startdate
22-03-2026
-
tuw.event.enddate
26-03-2026
-
tuw.event.online
On Site
-
tuw.event.type
Event for scientific audience
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tuw.event.place
Tucson, AZ
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tuw.event.country
US
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tuw.event.presenter
Veryser, Bram
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wb.sciencebranch
Elektrotechnik, Elektronik, Informationstechnik
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wb.sciencebranch.oefos
2020
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wb.sciencebranch.value
100
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item.fulltext
no Fulltext
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item.languageiso639-1
en
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item.openairecristype
http://purl.org/coar/resource_type/c_5794
-
item.cerifentitytype
Publications
-
item.grantfulltext
none
-
item.openairetype
conference paper
-
crisitem.author.dept
reliability - IMEC (Leuven, BE)
-
crisitem.author.dept
E360-01 - Forschungsbereich Mikroelektronik
-
crisitem.author.dept
Global TCAD Solutions GmbH (GTS), Vienna, Austria
-
crisitem.author.dept
imec, Leuven, Belgium
-
crisitem.author.dept
imec, Leuven, Belgium
-
crisitem.author.dept
imec, Leuven, Belgium
-
crisitem.author.dept
KU Leuven, Belgium
-
crisitem.author.dept
imec, Leuven, Belgium
-
crisitem.author.dept
imec, Leuven, Belgium
-
crisitem.author.dept
KU Leuven, Belgium
-
crisitem.author.dept
E360 - Institut für Mikroelektronik
-
crisitem.author.dept
imec, Leuven, Belgium
-
crisitem.author.dept
KU Leuven, Belgium
-
crisitem.author.dept
imec, Leuven, Belgium
-
crisitem.author.orcid
0009-0001-2733-3978
-
crisitem.author.orcid
0000-0001-6042-759X
-
crisitem.author.orcid
0000-0002-5348-2096
-
crisitem.author.parentorg
E360 - Institut für Mikroelektronik
-
crisitem.author.parentorg
E350 - Fakultät für Elektrotechnik und Informationstechnik