<div class="csl-bib-body">
<div class="csl-entry">Hadámek, T., Bendra, M., Fiorentini, S., Ender, J., Orio, R., Gös, W., Selberherr, S., & Sverdlov, V. (2021). Temperature increase in STT-MRAM at writing: A fully three-dimensional finite element approach. In <i>2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS’2021)</i>. 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Caen, France. IEEE. https://doi.org/10.1109/EuroSOI-ULIS53016.2021.9560669</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/77445
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dc.description.abstract
The writing process in spin transfer torque magnetoresistive random access memories is facilitated by elevated temperatures. In this work we investigate the temperature in the free layer (FL) during switching. With our fully three-dimensional (3D) finite element method simulation approach, we numerically solve the heat transport equation coupled to the electron, spin, and magnetization dynamics and demonstrate that the FL temperature is highly inhomogeneous due to non-uniform magnetization of the FL during switching. While the average temperature in the FL can be obtained based on an average current density and an averaged potential drop across the tunnel barrier in a one-dimensional model, a fully 3D model is required to evaluate the large local temperature variations.
en
dc.language.iso
en
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dc.subject
Electrical and Electronic Engineering
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dc.subject
Condensed Matter Physics
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dc.subject
Electronic, Optical and Magnetic Materials
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dc.subject
Materials Chemistry
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dc.title
Temperature increase in STT-MRAM at writing: A fully three-dimensional finite element approach
en
dc.type
Konferenzbeitrag
de
dc.type
Inproceedings
en
dc.relation.publication
2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS'2021)
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dc.relation.doi
10.1109/EuroSOI-ULIS53016.2021
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dc.relation.issn
0038-1101
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dc.type.category
Full-Paper Contribution
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tuw.booktitle
2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS'2021)
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tuw.peerreviewed
true
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tuw.relation.publisher
IEEE
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tuw.researchTopic.id
C6
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tuw.researchTopic.name
Modelling and Simulation
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tuw.researchTopic.value
100
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tuw.publication.orgunit
E360 - Institut für Mikroelektronik
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tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
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tuw.publisher.doi
10.1109/EuroSOI-ULIS53016.2021.9560669
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dc.description.numberOfPages
1
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tuw.event.name
2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)