<div class="csl-bib-body">
<div class="csl-entry">Kupka, T. (2018). <i>Assessment of the environmental performance of standard printed circuit board production and embedded component packaging at AT&S, Leoben</i> [Diploma Thesis, Technische Universität Wien]. reposiTUm. http://hdl.handle.net/20.500.12708/80013</div>
</div>
-
dc.identifier.uri
http://hdl.handle.net/20.500.12708/80013
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dc.description.abstract
null
de
dc.format
204 Seiten
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dc.language
English
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dc.language.iso
en
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dc.subject
Product Carbon Footprint
de
dc.subject
Printed Circuit Boards
de
dc.subject
Embedded Corponent Packaging
de
dc.subject
Product Carbon Footprint
en
dc.subject
Leiterplatten
en
dc.subject
Embedded Corponent Packaging
en
dc.title
Assessment of the environmental performance of standard printed circuit board production and embedded component packaging at AT&S, Leoben
en
dc.type
Thesis
en
dc.type
Hochschulschrift
de
dc.contributor.affiliation
TU Wien, Österreich
-
dc.publisher.place
Wien
-
tuw.thesisinformation
Technische Universität Wien
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tuw.publication.orgunit
E307 - Institut für Konstruktionswissenschaften und Technische Logistik
