2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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Book details Buch-Details

Book title Buchtitel
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
 
Publisher Herausgeber
IEEE Conference Publications
 
Place of publishing Erscheinungsort
USA
 

Publications Publikationen

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PreviewAuthor(s)TitleTypeIssue Date
1Singulani, A. P. ; Ceric, H. ; Filipovic, L. ; Langer, E. Impact of bosch scallops dimensions on stress of an open through Silicon Via technologyKonferenzbeitrag Inproceedings2013
2Lederer, M. ; Czerny, B. ; Nagl, B. ; Trnka, A. ; Khatibi, G. ; Thoben, M. Simulation of stress concentrations in wire-bonds using a novel strain gradient theoryKonferenzbeitrag Inproceedings2013