2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Book title Buchtitel
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Singulani, A. P. ; Ceric, H. ; Filipovic, L. ; Langer, E. | Impact of bosch scallops dimensions on stress of an open through Silicon Via technology | Konferenzbeitrag Inproceedings | 2013 | |
| 2 | Lederer, M. ; Czerny, B. ; Nagl, B. ; Trnka, A. ; Khatibi, G. ; Thoben, M. | Simulation of stress concentrations in wire-bonds using a novel strain gradient theory | Konferenzbeitrag Inproceedings | 2013 |