2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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Book details Buch-Details

Book title Buchtitel
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
 
Publisher Herausgeber
IEEE
 
Place of publishing Erscheinungsort
Deutschland
 

Publications Publikationen

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PreviewAuthor(s)TitleTypeIssue Date
1Mazloum Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Czerny, Bernhard ; Nicolics, Johann ; Weiss, Laurenz Reliability analysis of Cu wire bonds in microelectronic packagesKonferenzbeitrag Inproceedings2016