Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Ceric, H. ; de Orio, R. L. ; Selberherr, S. | Analysis of solder bump electromigration reliability | Konferenzbeitrag Inproceedings | 2013 | |
| 2 | Singulani, A.P. ; Ceric, H. ; Langer, E. | Stress evolution on tungsten thin-film of an open through silicon via technology | Konferenzbeitrag Inproceedings | 2013 | |
| 3 | Makarov, Alexander ; Sverdlov, Viktor ; Selberherr, Siegfried | Transverse domain wall formation in a free layer: A mechanism for switching failure in a MTJ-based STT-MRAM | Konferenzbeitrag Inproceedings | 2013 | |
| 4 | Osintsev, Dimitry ; Makarov, Alexander ; Sverdlov, Viktor ; Selberherr, Siegfried | Using strain to increase the reliability of scaled spin MOSFETs | Konferenzbeitrag Inproceedings | 2013 |