European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)

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Description

Event name
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)
 
Event type
Event for scientific audience
 
Start date
23-09-2019
End date
26-09-2019
 
Location
Maastricht
Country
Netherlands
 
Event format Veranstaltungsformat
On Site

Publications Publikationen

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Author:  Ceric, Hajdin

Results 1-6 of 6 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Ceric, Hajdin ; Zahedmanesh, Houman ; Croes, Kristof Analysis of Electromigration Failure of Nano-Interconnects through a Combination of Modeling and Experimental MethodsPräsentation Presentation2019
2Sharma, Prateek ; Tyaginov, S. E. ; Wimmer, Yannick ; Rudolf, Florian ; Rupp, Karl ; Enichlmair, H. ; Park, J.M. ; Ceric, Hajdin ; Grasser, Tibor Comparison of Analytic Distribution Function Models for Hot-Carrier Degradation in nLDMOSFETsKonferenzbeitrag Inproceedings2015
3Zisser, Wolfhard ; Ceric, Hajdin ; Weinbub, Josef ; Selberherr, Siegfried Electromigration Reliability of Open TSV StructuresKonferenzbeitrag Inproceedings2014
4Tyaginov, S. E. ; Starkov, Ivan ; Triebl, Oliver ; Cervenka, Johann ; Jungemann, C. ; Carniello, Sara ; Park, Jong Mun ; Enichlmair, H. ; Karner, Markus ; Kernstock, Christian ; Seebacher, E. ; Minixhofer, R. ; Ceric, Hajdin ; Grasser, Tibor Interface Traps Density-of-States as a Vital Component for Hot-Carrier Degradation ModelingKonferenzbeitrag Inproceedings2010
5Ceric, Hajdin ; Selberherr, Siegfried Simulative Prediction of the Resistance Change due to Electromigration Induced Void EvolutionPräsentation Presentation2002
6Singulani, Anderson P. ; Ceric, Hajdin ; Selberherr, Siegfried Stress Evolution in the Metal Layers of TSVs with Bosch ScallopsPräsentation Presentation2013