Journal of Microelectronics and Electronic Packaging

Title Titel

e-ISSN

1555-8037

ISSN

1551-4897

Publisher Herausgeber

IMAPS

Peer reviewed Begutachtet

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		Preview	Author(s)	Title	Type	Issue Date
	1		Czerny, Bernhard ; Khatibi Damavandi, Golta	Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics	Article Artikel	2022