Record link: 
http://hdl.handle.net/20.500.12708/144361
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Title: 
Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
en
Citation: 
Czerny, B., & Khatibi Damavandi, G. (2022). Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics. Journal of Microelectronics and Electronic Packaging, 19, 49–55. https://doi.org/10.4071/imaps.1717134
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Publisher DOI: 
10.4071/imaps.1717134
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Publication Type: 
Article - Original Research Article
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Artikel - Original Research Article
de
Language: 
English
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Authors: 
Czerny, Bernhard 
Khatibi Damavandi, Golta 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Journal: 
Journal of Microelectronics and Electronic Packaging 
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ISSN: 
1551-4897
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Date (published): 
2022
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Number of Pages: 
7
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Publisher: 
IMAPS
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Peer reviewed: 
Yes
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Keywords: 
power module reliability; power cycling; shear test; thermomechanical fatigue; wire bond interconnects; Accelerated Testing; BAMFIT; wire bond lift-off; CTE mismatch
en
Research Areas: 
Surfaces and Interfaces: 50%
Sustainable and Low Emission Mobility: 20%
Modeling and Simulation: 30%
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Science Branch: 
1040 - Chemie: 50%
2020 - Elektrotechnik, Elektronik, Informationstechnik: 50%
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