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Full name Familienname, Vorname
Khatibi, G.
 

Own Publications Eigene Publikationen

Results 1-20 of 33 (Search time: 0.003 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Lederer, M. ; Gökdeniz, Z. ; Khatibi, G. ; Nicolics, J. Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packagesArtikel Article 2021
2Sayyadi, R. ; Khodabakhshi, F. ; Javid, N. Shahamat ; Khatibi, G. Influence of graphene content and nickel decoration on the microstructural and mechanical characteristics of the Cu/Sn-Ag-Cu/Cu soldered jointArtikel Article 2020
3Lederer, M. ; Kotas, A. Betzwar ; Khatibi, G. A lifetime assessment and prediction method for large area solder jointsArtikel Article 2020
4Czerny, B. ; Khatibi, G. Interface characterization of Cu-Cu ball bonds by a fast shear fatigue methodArtikel Article 2020
5Saghaeian, F. ; Lederer, M. ; Hofer, A. ; Todt, J. ; Keckes, J. ; Khatibi, G. Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structureArtikel Article 2019
6Popok, V. N. ; Buhrkal-Donau, S. ; Czerny, B. ; Khatibi, G. ; Luo, H. ; Iannuzzo, F. ; Pedersen, K. B. Comparative study of wire bond degradation under power and mechanical accelerated testsArtikel Article 2019
7Khatibi, G. ; Betzwar Kotas, A. ; Lederer, M. Effect of aging on mechanical properties of high temperature Pb-rich solder jointsArtikel Article 2018
8Czerny, B. ; Khatibi, G. Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAlArtikel Article 2018
9Betzwar Kotas, A. ; Khatibi, G. Isothermal bending fatigue response of solder joints in high power semiconductor test structuresArtikel Article 2017
10Delshadmanesh, M. ; Khatibi, G. ; Ghomsheh, M. Zare ; Lederer, M. ; Zehetbauer, M. ; Danninger, H. Influence of microstructure on fatigue of biocompatible β-phase Ti-45NbArtikel Article 2017
11Suhir, E. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit StressesKonferenzbeitrag Inproceedings2016
12Walter, T. ; Lederer, M. ; Khatibi, G. Delamination of polyimide/Cu films under mixed mode loadingArtikel Article 2016
13Czerny, B. ; Khatibi, G. Interface reliability and lifetime prediction of heavy aluminum wire bondsArtikel Article 2016
14Suhir, E. ; Yi, S. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. Semiconductor film grown on a circular substrate: predictive modeling of lattice-misfit stressesArtikel Article 2016
15Magnien, J. ; Khatibi, G. ; Lederer, M. ; Ipser, H. Investigation of interfacial behavior in miniaturized solder interconnectsArtikel Article 2016
16Lederer, M. ; Lassnig, A. ; Khatibi, G. ; Delshadmanesh, M. Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testingKonferenzbeitrag Inproceedings2015
17Suhir, E. ; Bensoussan, A. ; Khatibi, G. ; Nicolics, J. Probabilistic design for reliability in electronics and photonics: Role, significance, attributes, challengesKonferenzbeitrag Inproceedings2015
18Khatibi, G. ; Lederer, M. ; Betzwar Kotas, A. ; Frotscher, M. ; Krause, A. ; Poehlmann, S. High-cycle fatigue behavior of thin-walled CoCr tubesArtikel Article2015
19Walter, T. ; Khatibi, G. ; Nelhiebel, M. ; Heinz, W. ; Robl, W. High cycle fatigue properties of Cu filmsArtikel Article2015
20Lassnig, A. ; Pelzer, R. ; Gammer, C. ; Khatibi, G. Role of intermetallics on the mechanical fatigue behavior of Cu-Al ball bond interfacesArtikel Article2015