Lederer, M., Kotas, A. B., & Khatibi, G. (2020). A lifetime assessment and prediction method for large area solder joints. Microelectronics Reliability, 114(113888), 113888. https://doi.org/10.1016/j.microrel.2020.113888
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
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Zeitschrift:
Microelectronics Reliability
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ISSN:
0026-2714
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Datum (veröffentlicht):
2020
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Umfang:
7
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Verlag:
PERGAMON-ELSEVIER SCIENCE LTD
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Peer Reviewed:
Ja
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Keywords:
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Atomic and Molecular Physics, and Optics; Safety, Risk, Reliability and Quality; Surfaces, Coatings and Films
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Forschungsschwerpunkte:
Structure-Property Relationship: 30% Materials Characterization: 30% Modelling and Simulation: 40%
