Record link: 
http://hdl.handle.net/20.500.12708/141514
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Title: 
A lifetime assessment and prediction method for large area solder joints
en
Citation: 
Lederer, M., Kotas, A. B., & Khatibi, G. (2020). A lifetime assessment and prediction method for large area solder joints. Microelectronics Reliability, 114(113888), 113888. https://doi.org/10.1016/j.microrel.2020.113888
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Publisher DOI: 
10.1016/j.microrel.2020.113888
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Publication Type: 
Article - Original Research Article
en
Language: 
English
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Authors: 
Lederer, M. 
Kotas, A. Betzwar 
Khatibi, G. 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Journal: 
Microelectronics Reliability 
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ISSN: 
0026-2714
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Date (published): 
2020
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Number of Pages: 
7
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Publisher: 
PERGAMON-ELSEVIER SCIENCE LTD
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Peer reviewed: 
Yes
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Keywords: 
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Atomic and Molecular Physics, and Optics; Safety, Risk, Reliability and Quality; Surfaces, Coatings and Films
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Research Areas: 
Structure-Property Relationship: 30%
Materials Characterization: 30%
Modelling and Simulation: 40%
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Science Branch: 
Chemie
Elektrotechnik, Elektronik, Informationstechnik
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