| Preview | Authors / Editors | Title | Type | Issue Date |
| 1 | | Steinhögl, W. ; Schindler, G. ; Steinlesberger, Gernot ; Traving, M. ; Engelhardt, C.M. | Surfce and Grain Boundary Scattering: A Modelling Study of Effects Domainating the Electrical Resistivity in sub-50nm Copper Lines | Präsentation Presentation | 2002 |
| 2 | | Schindler, G. ; Steinhögl, W. ; Steinlesberger, Gernot ; Traving, M. ; Engelhardt, C.M. | Recent Advances for Nano Interconnects:Conductor Reliability and Resistivity | Präsentation Presentation | 2002 |
| 3 | | Traving, M. ; Schindler, G. ; Steinlesberger, Gernot ; Steinhögl, W. ; Engelhardt, C.M. | On The Way to the 2.5 nm Barrier For End-of-Roadmap MPUs | Präsentation Presentation | 2002 |
| 4 | | Steinlesberger, Gernot ; Steinhögl, W. ; Schindler, G. ; Engelhardt, C.M. ; Traving, M. ; Bertagnolli, Emmerich | Microsturcture Study of Cu Damascene Nano-Interconnects | Präsentation Presentation | 2002 |
| 5 | | Steinlesberger, Gernot ; Engelhardt, C.M. ; Schindler, G. ; Steinhögl, W. ; Grasow, A. von ; Mosig, K. ; Bertagnolli, Emmerich | Electrical Assessment of Copper Damascene Interconnects Down to sub 50 nm Feature Sizes | Präsentation Presentation | 2002 |
| 6 | | Engelhardt, C.M. ; Schindler, G. ; Steinhögl, W. ; Steinlesberger, Gernot | Challenges of Interconnection Technology Till the End of the Roadmap and Beyond | Präsentation Presentation | 2002 |
