Datensatz Zitierlink: 
http://hdl.handle.net/20.500.12708/136506
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Titel: 
A Computationally Cheap Error Estimator for the 3D Eddy Current Problem Using a MSFEM Approach Based on the A-Formulation
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Zitat: 
Schobinger, M., & Hollaus, K. (2022). A Computationally Cheap Error Estimator for the 3D Eddy Current Problem Using a MSFEM Approach Based on the A-Formulation. In S. BARMADA (Ed.), 2022 IEEE 20th Biennial Conference on Electromagnetic Field Computation (CEFC) (pp. 1–2). IEEE. https://doi.org/10.1109/CEFC55061.2022.9940671
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Verlags-DOI: 
10.1109/CEFC55061.2022.9940671
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Publikationstyp: 
Konferenzbeitrag - Full-Paper Contribution
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Sprache: 
Englisch
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Autor_innen: 
Schobinger, Markus 
Hollaus, Karl 
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Organisations­einheit: 
E101-03-1 - Forschungsgruppe Computational Mathematics in Engineering 
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Erschienen in: 
2022 IEEE 20th Biennial Conference on Electromagnetic Field Computation (CEFC) 
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ISBN: 
978-1-6654-6833-6
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DOI des Buches: 
10.1109/CEFC55061.2022
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Datum (veröffentlicht): 
2022
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Veranstaltungs­name: 
2022 IEEE 20th Biennial Conference on Electromagnetic Field Computation (CEFC) 
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Veranstaltungs­zeitraum: 
24-Okt-2022 - 26-Okt-2022
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Veranstaltungs­ort: 
Vereinigte Staaten von Amerika
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Umfang: 
2
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Verlag: 
IEEE
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Keywords: 
eddy currents; error estimator; FEM; multiscale
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Abstract: 
The multiscale finite element method allows for the efficient calculation of eddy currents in laminated cores. This paper presents an error estimator which can be calculated on the same coarse mesh as the multiscale solution, making it computationally cheap while providing an accurate estimation of the error for both linear and nonlinear materials. Because of its local structure, this estimator enables adaptive mesh refinement.
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Projekttitel: 
Hochleistungs-Mehrskalen-Finite-Elemente-Methoden hp-MSFEMs: P 31926-N35 (Fonds zur Förderung der wissenschaftlichen Forschung (FWF)) 
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Forschungs­schwerpunkte: 
Mathematical and Algorithmic Foundations: 50%
Modeling and Simulation: 50%
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Wissenschafts­zweig: 
1010 - Mathematik: 100%
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Enthalten in den Sammlungen:
Conference Paper

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