Record link: 
http://hdl.handle.net/20.500.12708/142086
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Title: 
Ready for Industrial Use? A User Study of Spatial Augmented Reality in Industrial Assembly
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Citation: 
Zigart, T., & Schlund, S. (2022). Ready for Industrial Use? A User Study of Spatial Augmented Reality in Industrial Assembly. In Proceedings 2022 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct) (pp. 60–65). https://doi.org/10.1109/ISMAR-Adjunct57072.2022.00022
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Publisher DOI: 
10.1109/ISMAR-Adjunct57072.2022.00022
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Language: 
English
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Authors: 
Zigart, Tanja 
Schlund, Sebastian 
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Organisational Unit: 
E330-03 - Forschungsbereich Mensch-Maschine-Interaktion 
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Published in: 
Proceedings 2022 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct) 
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Date (published): 
15-Dec-2022
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Event name: 
2022 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct) 
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Event date: 
17-Oct-2022 - 21-Oct-2022
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Event place: 
Singapore
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Number of Pages: 
6
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Peer reviewed: 
Yes
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Keywords: 
Manufacturing; Evaluation; User Study; Spatial Augmented Reality
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Abstract: 
Spatial augmented reality (SAR) allows embedding instructions in the operator's field of view in manufacturing processes while hands-free working is possible. In this paper, we present the results of a field study in manufacturing to evaluate on the industrial readiness of SAR. We compared a worker assistance system via a tablet with a spatial augmented reality projection in a user study with skilled workers and students when assembling and wiring an industrial control panel. Human factors and process indicators are evaluated, qualitative feedback is summarized, and potential improvements are discussed.
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Research Areas: 
Digital Transformation in Manufacturing: 30%
Visual Computing and Human-Centered Technology: 50%
Beyond TUW-research foci: 20%
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Science Branch: 
1020 - Informatik: 20%
5020 - Wirtschaftswissenschaften: 50%
2119 - Sonstige Technische Wissenschaften: 30%
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Appears in Collections:
Conference Paper

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