<div class="csl-bib-body">
<div class="csl-entry">Hackl, T. (2020). <i>Automated probe-sample alignment for the evaluation of integrated circuits</i> [Diploma Thesis, Technische Universität Wien]. reposiTUm. https://doi.org/10.34726/hss.2020.60605</div>
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dc.identifier.uri
https://doi.org/10.34726/hss.2020.60605
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/1481
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dc.description.abstract
By measuring and testing integrated circuits, quality and functionality can already be determined during and after the production. But with ever increasing demands, such as cost or efficiency, the complexity and density of the circuits is also increasing. This leads to ever smaller structures and contact pads, that pose challenges to the measurements. As a result, a more accurate alignment between the measurement probe to the investigated circuit is necessary. Currently, testing is achieved utilizing manual probing stations, where the alignment is usually done by a human. Due to bad reproducibility and slow execution, automation of this process is proposed in this work. To this end, a vision guided alignment system is implemented and its accuracy is evaluated. Various machine-vision techniques for spatial detection of the objects position, such as the probes tip and the samples contact pad, are implemented and compared. The images are acquired utilizing a camera and an objective lens. To measure the vertical positions, the focus of this optical system is adjusted with the usage of focusing algorithms. The method "Tenenbaum variance" shows the best performance. The horizontal position of the objects is measured using "Template matching". After the measurement of the spatial positions, alignment is achieved by controlling positioning stages. Algorithms to accelerate the alignment process, as well as methods to increase the robustness are presented and compared. Since the determination of the positioning accuracy with usual probes is not possible, an atomic force microscope utilizing a piezoresistive cantilever is implemented. This offers the possibility of performing a scan after the completed alignment, thereby determining the spatial offset. The achieved positioning accuracy in vertical and horizontal direction are 880nm and 490 nm, respectively. The average duration for the alignment process is 48 s. Limits, such as the objective lenses depth of field and magnification as well as the cameras resolution, result from a trade-off between accuracy, execution speed and ease of implementation.
en
dc.language
English
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dc.language.iso
en
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dc.rights.uri
http://rightsstatements.org/vocab/InC/1.0/
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dc.subject
Nanometrology
de
dc.subject
Precision engineering
de
dc.subject
Nanopositioning
de
dc.subject
Image processing
de
dc.subject
Nanometrology
en
dc.subject
Precision engineering
en
dc.subject
Nanopositioning
en
dc.subject
Image processing
en
dc.title
Automated probe-sample alignment for the evaluation of integrated circuits
en
dc.type
Thesis
en
dc.type
Hochschulschrift
de
dc.rights.license
In Copyright
en
dc.rights.license
Urheberrechtsschutz
de
dc.identifier.doi
10.34726/hss.2020.60605
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dc.contributor.affiliation
TU Wien, Österreich
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dc.rights.holder
Thomas Hackl
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dc.publisher.place
Wien
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tuw.version
vor
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tuw.thesisinformation
Technische Universität Wien
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dc.contributor.assistant
Poik, Mathias
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tuw.publication.orgunit
E376 - Institut für Automatisierungs- und Regelungstechnik