Record link: 
http://hdl.handle.net/20.500.12708/153367
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Title: 
Recycling and Upcycling of chips waste material by using friction surfacing
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Citation: 
Bleicher, F., Baumann, C., Krall, S., & Pfefferkorn, F. (2022, August 25). Recycling and Upcycling of chips waste material by using friction surfacing [Conference Presentation]. CIRP STC-CWG Industrial Symbiosis 2022, Bilbao, Spain. http://hdl.handle.net/20.500.12708/153367
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Publication Type: 
Presentation - Conference Presentation
en
Language: 
English
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Authors: 
Bleicher, Friedrich 
Baumann, Christian 
Krall, Stephan 
Pfefferkorn, Frank 
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Organisational Unit: 
E311-01 - Forschungsbereich Fertigungstechnik 
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Date (published): 
25-Aug-2022
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Event name: 
CIRP STC-CWG Industrial Symbiosis 2022 
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Event date: 
21-Aug-2022 - 27-Aug-2022
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Event place: 
Bilbao, Spain
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Keywords: 
using friction surfacing
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Research Areas: 
Computational Materials Science: 100%
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Science Branch: 
2030 - Maschinenbau: 70%
2050 - Werkstofftechnik: 15%
2020 - Elektrotechnik, Elektronik, Informationstechnik: 15%
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