<div class="csl-bib-body">
<div class="csl-entry">Czerny, B., & Khatibi Damavandi, G. (2022). Highly accelerated lifetime testing in power electronics. In <i>IMAPS 2021 - 54th International Symposium on Microelectronics</i>. IMAPS 2021 54th International Symposium on Microelectronics, San Diego, Austria. https://doi.org/10.4071/1085-8024-2021.1.000390</div>
</div>
-
dc.identifier.uri
http://hdl.handle.net/20.500.12708/158296
-
dc.description.abstract
This paper presents case studies on application of accelerated mechanical fatigue testing for evaluation of wire bond interconnects and interfaces in electronic devices. A dedicated experimental set-up is designed to induce fatigue failure in the weak sites of the devices by reproducing the failure modes occurring during operation. Acceleration is achieved by increasing the mechanical testing frequency enabling determination of lifetime curves in a very short time. Exemplary studies on the degradation and fatigue failure of heavy wire bonds typically used in power electronics are presented and advantages and some restrictions of the proposed method are briefly discussed.
en
dc.language.iso
en
-
dc.subject
IGBT power module reliability
en
dc.subject
power cycling vs shear test qualification
en
dc.subject
thermo-mechanical fatigue
en
dc.subject
wire bond interconnects
en
dc.title
Highly accelerated lifetime testing in power electronics
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.type.category
Full-Paper Contribution
-
tuw.booktitle
IMAPS 2021 - 54th International Symposium on Microelectronics
-
tuw.researchTopic.id
M1
-
tuw.researchTopic.id
E2
-
tuw.researchTopic.id
C6
-
tuw.researchTopic.name
Surfaces and Interfaces
-
tuw.researchTopic.name
Sustainable and Low Emission Mobility
-
tuw.researchTopic.name
Modeling and Simulation
-
tuw.researchTopic.value
50
-
tuw.researchTopic.value
20
-
tuw.researchTopic.value
30
-
tuw.publication.orgunit
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
tuw.publisher.doi
10.4071/1085-8024-2021.1.000390
-
tuw.author.orcid
0000-0001-8147-3122
-
tuw.event.name
IMAPS 2021 54th International Symposium on Microelectronics
-
tuw.event.startdate
11-10-2021
-
tuw.event.enddate
14-10-2021
-
tuw.event.online
Hybrid
-
tuw.event.type
Event for scientific audience
-
tuw.event.place
San Diego
-
tuw.event.country
AT
-
tuw.event.presenter
Czerny, Bernhard
-
wb.sciencebranch
Chemie
-
wb.sciencebranch
Elektrotechnik, Elektronik, Informationstechnik
-
wb.sciencebranch.oefos
1040
-
wb.sciencebranch.oefos
2020
-
wb.sciencebranch.value
70
-
wb.sciencebranch.value
30
-
item.openairetype
Inproceedings
-
item.openairetype
Konferenzbeitrag
-
item.grantfulltext
restricted
-
item.cerifentitytype
Publications
-
item.cerifentitytype
Publications
-
item.languageiso639-1
en
-
item.openairecristype
http://purl.org/coar/resource_type/c_18cf
-
item.openairecristype
http://purl.org/coar/resource_type/c_18cf
-
item.fulltext
no Fulltext
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
-
crisitem.author.dept
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit