Czerny, B., & Khatibi Damavandi, G. (2022). Highly accelerated lifetime testing in power electronics. In IMAPS 2021 - 54th International Symposium on Microelectronics. IMAPS 2021 54th International Symposium on Microelectronics, San Diego, Austria. https://doi.org/10.4071/1085-8024-2021.1.000390
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
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Published in:
IMAPS 2021 - 54th International Symposium on Microelectronics
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Date (published):
2022
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Event name:
IMAPS 2021 54th International Symposium on Microelectronics
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Event date:
11-Oct-2021 - 14-Oct-2021
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Event place:
San Diego, Austria
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Keywords:
IGBT power module reliability; power cycling vs shear test qualification; thermo-mechanical fatigue; wire bond interconnects
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Abstract:
This paper presents case studies on application of accelerated mechanical fatigue testing for evaluation of wire bond interconnects and interfaces in electronic devices. A dedicated experimental set-up is designed to induce fatigue failure in the weak sites of the devices by reproducing the failure modes occurring during operation. Acceleration is achieved by increasing the mechanical testing frequency enabling determination of lifetime curves in a very short time. Exemplary studies on the degradation and fatigue failure of heavy wire bonds typically used in power electronics are presented and advantages and some restrictions of the proposed method are briefly discussed.
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Research Areas:
Surfaces and Interfaces: 50% Sustainable and Low Emission Mobility: 20% Modeling and Simulation: 30%
