<div class="csl-bib-body">
<div class="csl-entry">Melinc, D. (2021). <i>Mechanical and metallographic characterization of the ternary Sn/Bi/In solder system for self-healing applications</i> [Dissertation, Technische Universität Wien]. reposiTUm. https://doi.org/10.34726/hss.2021.96864</div>
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dc.identifier.uri
https://doi.org/10.34726/hss.2021.96864
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/19050
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dc.description.abstract
This work presents mechanical and metallographic investigations in the Sn/Bi/In ternary solder system for self-healing applications. The study starts with a detailed analysis of the ternary system under application of the CALPHAD method to scan the composition range of solders for desired microstructural properties related to the distinct environment in microelectronic devices. The solder alloy Sn37Bi4In is chosen due to its pursuant mechanical and microstructural properties complemented with heat-triggered healing effects at low temperatures. An extended investigation on the influence of temperature and alloying elements, including long-term stability tests above the solidus temperature, evaluates the evolution of microstructure and mechanical performance. To determine whether the Sn37Bi4In solder, as a representative for the ternary system, can be healed at application-typical temperatures, dog bone-shaped specimens are mold, machined, and plastically damaged during tension-compression cycling (loading protocol). In the subsequent healing step, the effect of liquid-assisted healing with different liquid phase fractions is utilized. In the evaluation process, the mechanical performance of beforehand fatigued samples and the healed samples is assessed by stress-strain curves of tensile tests and converted into significant materials parameters for further evaluation.
en
dc.language
English
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dc.language.iso
en
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dc.rights.uri
http://rightsstatements.org/vocab/InC/1.0/
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dc.subject
Selbstheilung
de
dc.subject
Lot
de
dc.subject
Sn
de
dc.subject
Bi
de
dc.subject
In
de
dc.subject
Bleifrei
de
dc.subject
Metallographie
de
dc.subject
CALPHAD
de
dc.subject
Alterung
de
dc.subject
Self healing
en
dc.subject
solder
en
dc.subject
Sn
en
dc.subject
Bi
en
dc.subject
In
en
dc.subject
lead-free
en
dc.subject
metallography
en
dc.subject
CALPHAD
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dc.subject
aging
en
dc.title
Mechanical and metallographic characterization of the ternary Sn/Bi/In solder system for self-healing applications
en
dc.type
Thesis
en
dc.type
Hochschulschrift
de
dc.rights.license
In Copyright
en
dc.rights.license
Urheberrechtsschutz
de
dc.identifier.doi
10.34726/hss.2021.96864
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dc.contributor.affiliation
TU Wien, Österreich
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dc.rights.holder
David Melinc
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dc.publisher.place
Wien
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tuw.version
vor
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tuw.thesisinformation
Technische Universität Wien
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tuw.publication.orgunit
E308 - Institut für Werkstoffwissenschaft und Werkstofftechnologie
