Mayer, F., Ehrmann, K., & Liska, R. (2023). Interpenetrating polymer networks with increased strenght and toughness for Hot Lithography. In RadTech Europe Conference and Exhibition 2023 : Abstract Book. RadTech Europe 2023 Conference & Exhibition, München, Germany. http://hdl.handle.net/20.500.12708/193230
RadTech Europe Conference and Exhibition 2023 : Abstract Book
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Datum (veröffentlicht):
Okt-2023
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Veranstaltungsname:
RadTech Europe 2023 Conference & Exhibition
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Veranstaltungszeitraum:
17-Okt-2023 - 18-Okt-2023
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Veranstaltungsort:
München, Deutschland
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Umfang:
1
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Keywords:
Hot Lithography; interpenetrating Polymer Network; Toughness
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Abstract:
Due to their high versatility additive manufacturing methods have become more relevant in industry over the last decades. However, the transition from model parts towards tough, functional parts is still hindered due to the brittle nature of free radical photopolymer networks. Often, efforts to make such networks more homogeneous and less densely crosslinked lead to low glass transitions and overall softening of the part.
In this study, we tackle the problem by intertwining a hard, load-bearing network with a soft elastic network based on epoxides and alcohols. Combined they yield a printable material with the desired overall mechanical properties. The more regulated network could be combined with strong material properties and an increased tensile toughness.
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Forschungsschwerpunkte:
Special and Engineering Materials: 20% Structure-Property Relationsship: 10% Non-metallic Materials: 70%