Record link: 
http://hdl.handle.net/20.500.12708/206568
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Title: 
Utilizing Grain Boundary Segregation Engineering for Nanostructured Tungsten Thin Films
en
Citation: 
Keckes, J., Alfreider, M., Wurmshuber, M., Hirle, A. V., Wurster, S., Riedl, H., & Kiener, D. (2024, March 4). Utilizing Grain Boundary Segregation Engineering for Nanostructured Tungsten Thin Films [Conference Presentation]. TMS 2024 Annual Meeting & Exhibition, Orlando, United States of America (the). http://hdl.handle.net/20.500.12708/206568
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Publication Type: 
Presentation - Conference Presentation
en
Language: 
English
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Authors: 
Keckes, Julius 
Alfreider, Markus 
Wurmshuber, Michael 
Hirle, Anna Viktoria 
Wurster, Stefan 
Riedl, Helmut 
Kiener, Daniel 
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Organisational Unit: 
E308-01-2 - Forschungsgruppe Angewandte Oberflächentechnik 
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Date (published): 
4-Mar-2024
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Event name: 
TMS 2024 Annual Meeting & Exhibition 
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Event date: 
3-Mar-2024 - 7-Mar-2024
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Event place: 
Orlando, United States of America (the)
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Keywords: 
Tungsten; Grain boundary; Microstructure; microcantilever
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Research Areas: 
Materials Characterization: 50%
Structure-Property Relationsship: 50%
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Science Branch: 
2030 - Maschinenbau: 20%
2050 - Werkstofftechnik: 80%
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Appears in Collections:
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