Comparative Analysis of Laser Cutting Efficiency and Edge Quality in High-Speed PCB Depaneling of FR4 Using CO2, Fiber, and DPSS Lasers with Multi-Axis Gantry Systems

Abstract

Rapid development in the areas of artificial intelligence, telecommunications, and other new technologies placed a demanding call for innovative and highly effective methods of manufacturing in printed circuit board (PCB) production. Laser-based de-paneling of PCBs has now become the way to achieve precision without mechanical forces, along with substantial other benefits such as low mechanical stress on materials, no tool wear, and high repeatability in achieving complex geometries. This thesis investigates the comparative efficiency and edge quality of different lasers, such as DPSS (532 nm), Fiber (1060 nm), and CO2 (10600 nm) in treating FR4 printed circuit boards (PCBs) of different thicknesses of 0.4, 0.6, 0.9, 1.0 and 1.6 mm. Utilizing a 5-axis Gantry Laser System with a 2-axis galvo scanner in integration with speedLAS® 1 CAM Processing Interface, the goal is to optimize cutting speed (in mm/s) while minimizing carbonization and thermal degradation on the cut edges. This study seeks to identify the optimal parameters for cutting FR4 materials with various laser types. Such applications are needed to keep electrical integrity and appearance. The research developed experimental results, such as scanning electronic microscopy tests, to explain microstructural consequences resulting from the interaction between various lasers and FR4 composites. Additionally, two-path programming techniques have been used, and their precision is likely to increase significantly. The current research aims to define the optimal laser and related processing parameters for various PCB thicknesses, which are capable of providing meaningful information for enhancing accuracy, efficiency, and quality in PCB depaneling amid rising demands within the electronics sector.Keywords: PCB Depaneling, FR4 Material, Laser Cutting, CO2 Laser, Fiber Laser, DPSS Laser, Multi-Axis Gantry System, Galvo Scanner, Cutting Speed Optimization, SEM Analysis, Carbonization Reduction, Thermal Degradation, Two Path Programming.speedLAS® is the trademark of the consortium of Dr. Bohrer Lasertec GmbH and SCHUNK Electronic Solutions GmbH