<div class="csl-bib-body">
<div class="csl-entry">Leroch, S., Stella, R., Hössinger, A., & Filipovic, L. (2024). MD Simulation of Epitaxial Recrystallization and Defect Structure of Al-Implanted 4H-SiC. In <i>2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)</i> (pp. 1–4). https://doi.org/10.1109/SISPAD62626.2024.10733052</div>
</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/212513
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dc.description.abstract
We have performed a molecular dynamics study for the recrystallization of Al-implanted 4H-SiC in dependence of annealing temperature and time. We show in that the principal physical picture of recrystallization is in line with experiments and former MD simulations with respect to the activation energy of recrystallization and its onset temperature (the minimum temperature necessary to initiate full recyrstallization of amorphous SiC). The annealed structures are poly-crystalline and show point defects, defect complexes, but also extended defects like interstitial clusters and stacking faults in dependence of the annealing temperature. Most of the residual defects are thermally stable and need longer annealing times than those accessible with MD simulations alone.
en
dc.description.sponsorship
Christian Doppler Forschungsgesells
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dc.language.iso
en
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dc.subject
activation energy for recrystallization
en
dc.subject
Al-implantated 4H-SiC
en
dc.subject
defect com-plexes and clusters
en
dc.subject
expitaxial regrowth
en
dc.subject
point defects
en
dc.title
MD Simulation of Epitaxial Recrystallization and Defect Structure of Al-Implanted 4H-SiC
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.contributor.affiliation
TU Wien, Austria
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dc.contributor.affiliation
Silvaco (United Kingdom), United Kingdom of Great Britain and Northern Ireland (the)
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dc.relation.isbn
979-8-3315-1635-2
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dc.relation.doi
10.1109/SISPAD62626.2024
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dc.description.startpage
1
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dc.description.endpage
4
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dc.relation.grantno
00000
-
dc.type.category
Full-Paper Contribution
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tuw.booktitle
2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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tuw.peerreviewed
true
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tuw.project.title
Multi-Scale-Prozessmodellierung von Halbleiter-Bauelemente und -Sensoren
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tuw.researchinfrastructure
Vienna Scientific Cluster
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tuw.researchTopic.id
C6
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tuw.researchTopic.id
C1
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tuw.researchTopic.name
Modeling and Simulation
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tuw.researchTopic.name
Computational Materials Science
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tuw.researchTopic.value
60
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tuw.researchTopic.value
40
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tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
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tuw.publication.orgunit
E056-04 - Fachbereich TU-DX: Towards Applications of 2D Materials
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tuw.publisher.doi
10.1109/SISPAD62626.2024.10733052
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dc.description.numberOfPages
4
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tuw.author.orcid
0000-0002-7787-4385
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tuw.author.orcid
0000-0003-1687-5058
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tuw.event.name
2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
en
tuw.event.startdate
24-09-2024
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tuw.event.enddate
27-09-2024
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tuw.event.online
On Site
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tuw.event.type
Event for scientific audience
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tuw.event.place
San Jose, CA
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tuw.event.country
US
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tuw.event.presenter
Leroch, Sabine
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wb.sciencebranch
Elektrotechnik, Elektronik, Informationstechnik
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wb.sciencebranch.oefos
2020
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wb.sciencebranch.value
100
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item.cerifentitytype
Publications
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item.languageiso639-1
en
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item.fulltext
no Fulltext
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item.openairetype
conference paper
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item.openairecristype
http://purl.org/coar/resource_type/c_5794
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item.grantfulltext
restricted
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crisitem.project.funder
Christian Doppler Forschungsgesells
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crisitem.project.grantno
00000
-
crisitem.author.dept
E360-01 - Forschungsbereich Mikroelektronik
-
crisitem.author.dept
TU Wien
-
crisitem.author.dept
E360 - Institut für Mikroelektronik
-
crisitem.author.dept
E360-01 - Forschungsbereich Mikroelektronik
-
crisitem.author.orcid
0000-0002-7787-4385
-
crisitem.author.orcid
0000-0003-1687-5058
-
crisitem.author.parentorg
E360 - Institut für Mikroelektronik
-
crisitem.author.parentorg
E350 - Fakultät für Elektrotechnik und Informationstechnik