2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Book title Buchtitel

ISBN

978-4-86348-803-8

Publisher Herausgeber

IEEE

DOI

10.23919/SISPAD57422.2023

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	Author(s)	Title	Type	Issue Date
1	Wilhelmer, Christoph ; Waldhör, Dominic ; Milardovich, Diego ; Cvitkovich, Lukas ; Waltl, Michael ; Grasser, Tibor	Intrinsic Electron Trapping in Amorphous Silicon Nitride (a-Si3N4:H)	Inproceedings Konferenzbeitrag	20-Nov-2023
2	Reiter, Tobias ; Toifl, Alexander ; Hössinger, Andreas ; Filipovic, Lado	Modeling Oxide Regrowth During Selective Etching in Vertical 3D NAND Structures	Inproceedings Konferenzbeitrag	20-Nov-2023
3	Leroch, Sabine ; Stella, Robert ; Hössinger, Andreas ; Filipovic, Lado	Molecular Dynamics Study of Al Implantation in 4H-SiC	Inproceedings Konferenzbeitrag	20-Nov-2023
4	Filipovic, Lado ; Bobinac, Josip ; Piso, Julius ; Reiter, Tobias	Physics-Informed Compact Model for SF6/O2 Plasma Etching	Inproceedings Konferenzbeitrag	20-Nov-2023
5	Hadamek, Tomas ; Jorstad, Nils Petter ; Goes, Wolfgang ; Selberherr, Siegfried ; Sverdlov, Viktor	Study of Self-Heating and its Effects in SOT-STT-MRAM	Inproceedings Konferenzbeitrag	20-Nov-2023