Leroch, S., Stella, R., Hössinger, A., & Filipovic, L. (2023). Molecular Dynamics Study of Al Implantation in 4H-SiC. In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 185–188). IEEE. https://doi.org/10.23919/SISPAD57422.2023.10319554