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| | Preview | Author(s) | Title | Type | Issue Date |
| 1 |  | Reiter, Tobias ; Filipovic, Lado | ViennaPS: A flexible framework for semiconductor process simulation | Article Artikel    | Dec-2025 |
| 2 | | Stella, Robert ; Leroch, Sabine ; Reiter, Tobias ; Hössinger, Andreas ; Filipovic, Lado | Physics-Based Multi-Scale Modeling of Angled Reactive Ion Etching | Inproceedings Konferenzbeitrag | 28-Oct-2025 |
| 3 | | Hu, Ziyi ; Junjie Li ; Shao, Hua ; Chen, Rui ; Filipovic, Lado ; Li, Ling | Physics-Informed Bayesian Optimization Framework for Etching Rate and Surface Roughness Co-Optimization | Inproceedings Konferenzbeitrag | 28-Oct-2025 |
| 4 | | Kostal, Roman ; Reiter, Tobias ; Filipovic, Lado | A New Module for Automated Optimization of Process TCAD Model Parameters | Inproceedings Konferenzbeitrag | 28-Oct-2025 |
| 5 | | Reiter, Tobias ; Toifl, Alexander ; Hossinger, Andreas ; Filipovic, Lado | Simulation of a Polymer-Free Drie Process Using SF₆/O₂ Plasma Etching | Inproceedings Konferenzbeitrag | 28-Oct-2025 |
| 6 | | Hu, Ziyi ; Lai, Panpan ; Ge, Rui ; Shao, Hua ; Zhai, Yuxuan ; Tong, Yu-Kai ; Feng, Zemeng ; Shang, Dashan ; Li, Junjie ; Chen, Rui ; Filipovic, Lado | Improvement of Selective Quasi Atomic Layer Etching of SiGe/Si by Plasma Surface Modification for Fishbone FET Fabrication | Article Artikel | 18-Sep-2025 |
| 7 | | Kostal, Roman ; Reiter, Tobias ; Manstetten, Paul ; Filipovic, Lado | Novel Approaches to Objective Function Design for Optimizing Process TCAD Model Parameters | Presentation Vortrag | 26-Jun-2025 |
| 8 | | Filipovic, Lado ; Baranowski, Izak ; Faber, Tim ; Nedjalkov, Mihail ; Koster, L J A ; Vasileska, Dragica ; Goodnick, Stephen | Theoretical Insights into Next-Generation Hot Carrier Solar Cells | Inproceedings Konferenzbeitrag | 22-May-2025 |
| 9 | | Reiter, Tobias ; Manstetten, Paul ; Filipovic, Lado | GPU-based Monte Carlo Ray Tracing for Flux Calculation in Process Simulation | Inproceedings Konferenzbeitrag | May-2025 |
| 10 | | Zhai, Yuxuan ; Ge, Rui ; Hu, Ziyi ; Li, Junjie ; Shao, Hua ; Cheng, Jiawei ; Filipovic, Lado ; Chen, Rui | Modeling the charging effect of the hardmask and silicon substrate during plasma etching in advanced nodes | Article Artikel | 14-Feb-2025 |
| 11 | | Fu, Yihao ; Shao, Hua ; Xia, Longrui ; Ge, Rui ; Bai, Lang ; He, Xiaobin ; Junjie Li ; Chen, Rui ; Wei, Yayi ; Li, Ling ; Filipovic, Lado | Atomic-Level Monte Carlo Modeling of SiN Deposition by PECVD | Inproceedings Konferenzbeitrag | 2025 |
| 12 | | Filipovic, Lado | From Atoms to Reactors: Multi-Scale Modeling for Semiconductor Fabrication | Inproceedings Konferenzbeitrag | 2025 |
| 13 | | Yuki, Ohuchi ; Stella, Robert ; Filipovic, Lado | Development of a Gaussian Approximation Potential for Gan With Point Defects and Mg Impurities | Inproceedings Konferenzbeitrag | 2025 |
| 14 | | Hu, Ziyi ; Li, Junjie ; Chen, Rui ; Shang, Dashan ; Wei, Yayi ; Wang, Zhongrui ; Li, Ling ; Filipovic, Lado | A Two-Step Dry Etching Model for Non-Uniform Etching Profile in Gate-All-Around Field-Effect Transistor Manufacturing | Article Artikel | 19-Dec-2024 |
| 15 |  | Faber, T ; Filipovic, L ; Koster, L J A | The Hot Phonon Bottleneck Effect in Metal Halide Perovskites | Article Artikel | 16-Dec-2024 |
| 16 | | Shao, Hua ; Reiter, Tobias ; Chen, Rui ; Li, Junjie ; Hu, Ziyi ; Wei, Yayi ; Li, Ling ; Filipovic, Lado | Loading Effect during SiGe/Si Stack Selective Isotropic Etching for Gate-All-Around Transistors | Article Artikel | 26-Nov-2024 |
| 17 | | Filipovic, Lado ; Reiter, Tobias | Spline Interpolation-Based Multi-Scale Model for Etching in a Chlorine-Argon Inductively Coupled Plasma | Inproceedings Konferenzbeitrag | 20-Jan-2024 |
| 18 |  | Reiter, Tobias ; Aguinsky, Luiz Felipe ; Souza Berti Rodrigues, Francio ; Weinbub, Josef ; Hössinger, Andreas ; Filipovic, Lado | Modeling the Impact of Incomplete Conformality During Atomic Layer Processing | Article Artikel | Jan-2024 |
| 19 | | Filipovic, Lado | Merging Reactor and Feature Scales for Plasma Etch Modeling | Inproceedings Konferenzbeitrag | 2024 |
| 20 | | Filipovic, Lado ; Reiter, Tobias | Multi-Scale Model for High Aspect Ratio TiN Etching in a Cl₂/Ar Inductively Coupled Plasma | Inproceedings Konferenzbeitrag | 2024 |
