Record link: 
http://hdl.handle.net/20.500.12708/225990
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Title: 
A New Module for Automated Optimization of Process TCAD Model Parameters
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Citation: 
Kostal, R., Reiter, T., & Filipovic, L. (2025). A New Module for Automated Optimization of Process TCAD Model Parameters. In 2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4). IEEE. https://doi.org/10.1109/SISPAD66650.2025.11186325
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Publisher DOI: 
10.1109/SISPAD66650.2025.11186325
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Language: 
English
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Authors: 
Kostal, Roman 
Reiter, Tobias 
Filipovic, Lado 
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Organisational Unit: 
E360-01 - Forschungsbereich Mikroelektronik 
E056-04 - Fachbereich TU-DX: Towards Applications of 2D Materials 
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Published in: 
2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 
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ISBN: 
979-8-3315-4884-1
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DOI of the book: 
10.1109/SISPAD66650.2025
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Date (published): 
28-Oct-2025
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Event name: 
2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 
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Event date: 
24-Sep-2025 - 26-Sep-2025
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Event place: 
Grenoble, France
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Number of Pages: 
4
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Publisher: 
IEEE
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Peer reviewed: 
Yes
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Keywords: 
Deposition; Emulation; Etching; Optimization; Process Simulation; Sensitivity Analysis
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Abstract: 
A new module for automated optimization of process TCAD model parameters is presented along with example use cases. Features include: novel ways of measuring profile discrepancy, seamless comparison of simulated 3D structures with 2D micrographs of experimental structures, and integration of state-of-the-art open source optimizers and tools for sensitivity analysis. Demonstrated through practical examples, the module enables excellent matching of simulated profiles to experimental micrographs for process calibration and provides valuable insights into parameter sensitivities using global sensitivity analysis, thereby addressing key challenges in TCAD model development.
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Project title: 
Multi-Scale-Prozessmodellierung von Halbleiter-Bauelemente und -Sensoren: 00000 (Christian Doppler Forschungsgesells) 
Virtuelle Technologieentwicklung - Important Project of Common European Interest Microelectronics/Communication Technologies: 6000013979 (Infineon Technologies Austria AG) 
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Research Areas: 
Digital Transformation in Manufacturing: 20%
Nanoelectronics: 10%
Modeling and Simulation: 70%
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Science Branch: 
2020 - Elektrotechnik, Elektronik, Informationstechnik: 100%
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Appears in Collections:
Conference Paper

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