Reiter, T., & Filipovic, L. (2025). ViennaPS: A flexible framework for semiconductor process simulation. SoftwareX, 32, Article 102453. https://doi.org/10.1016/j.softx.2025.102453
E360-01 - Forschungsbereich Mikroelektronik E056-04 - Fachbereich TU-DX: Towards Applications of 2D Materials
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Journal:
SoftwareX
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ISSN:
2352-7110
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Date (published):
Dec-2025
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Number of Pages:
7
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Publisher:
ELSEVIER
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Peer reviewed:
Yes
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Keywords:
Plasma etching simulation; Process simulation; Topography evolution; Software framework
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Abstract:
ViennaPS is an open-source software framework for simulating fabrication processes in semiconductor manufacturing, with a focus on topography evolution during etching and deposition. It uses a high-performance level-set method with a hierarchical run-length encoding data structure for efficient and fast geometry representation and evolution. ViennaPS supports both analytical and physics-based process models, including Monte Carlo ray tracing for flux calculation at the feature scale. Designed for flexibility and extensibility, it enables users to prototype new models or apply pre-configured ones. ViennaPS provides a customizable platform for researchers and engineers developing advanced process simulations in both academic and industrial settings.
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Research facilities:
Vienna Scientific Cluster
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Project title:
Multi-Scale-Prozessmodellierung von Halbleiter-Bauelemente und -Sensoren: 00000 (Christian Doppler Forschungsgesells)