Nicolics, Johann

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Nicolics, Johann
 
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Results 41-60 of 247 (Search time: 0.004 seconds).

PreviewAuthor(s)TitleTypeIssue Date
41Miskovic, Goran ; Aleksic, Obrad S ; Nikolic, Maria V ; Nicolics, Johann ; Radosavljevic, Goran ; Vasiljevic, Zorka Z ; Lukovic, Miloljub D ; Smetana, Walter Nanostructured SnO2 thick films for gas sensor application: analysis of structural and electronic propertiesArtikel Article2016
42Groß, Stephanie ; Beart, Karin ; Schmidt, Thomas ; Schuch, Bernhard ; Stahr, Hannes ; Morianz, Mike ; Nicolics, Johann ; Unger, Michael EmPower - Integrierte Leistungskomponenten für ElektrofahrzeugeKonferenzbeitrag Inproceedings2016
43Stahr, Hannes ; Unger, Michael ; Nicolics, Johann ; Morianz, Mike ; Gross, S. ; Böttcher, L. Thermal benchmark of a classic and novel embedded high-power 3-phase Inverter bridgeKonferenzbeitrag Inproceedings2016
44Miskovic, Goran ; Lukovic, Miloljub D. ; Nikolic, Maria Vesna ; Vasiljevic, Zorka Z. ; Nicolics, Johann ; Aleksic, Obrad S. Analysis of electronic properties of pseudobrookite thick films with possible application for gas sensorsKonferenzbeitrag Inproceedings 2016
45Unger, Michael ; Nicolics, Johann ; Stahr, Hannes ; Morianz, Mike ; Dosseul, Franck Thermal Performance of Novel Diode PackagesKonferenzbeitrag Inproceedings 2016
46Suhir, Ephraim ; Nicolics, Johann ; Bechou, Laurent Predicted Thermal Stresses in a Bow-Free Electronic Assembly for Automotive and Potential Aerospace ApplicationsKonferenzbeitrag Inproceedings2016
47Suhir, Ephraim ; Ghaffarian, R. ; Bechou, Laurent ; Nicolics, Johann Column-Grid-Array (CGA) Technology Could Lead to a Highly Reliable Package DesignKonferenzbeitrag Inproceedings2016
48Unger, Michael ; Stahr, Hannes ; Morianz, Mike ; Nicolics, Johann ; Dosseul, Franck Miniaturized Power-Diode Package with Superior Thermal Performance using Embedding TechnologyKonferenzbeitrag Inproceedings 2016
49Suhir, Ephraim ; Nicolics, Johann Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal StressesKonferenzbeitrag Inproceedings2016
50Suhir, Ephraim ; Nicolics, Johann Aerospace electronics-and-photonics (AEP) reliability has to be quantified to be assuredKonferenzbeitrag Inproceedings2016
51Stahr, Hannes ; Morianz, Mike ; Gross, S. ; Unger, Michael ; Nicolics, Johann ; Böttcher, L. Investigation of a power module with double sided cooling using a new concept for chip embeddingKonferenzbeitrag Inproceedings2016
52Khatibi, Golta ; Czerny, Bernhard ; Lassnig, Alice ; Lederer, Martin ; Magnien, Julien ; Nicolics, Johann ; Suhir, Ephraim A novel approach for evaluation of material interfaces in electronicsKonferenzbeitrag Inproceedings2016
53Mazloum Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Czerny, Bernhard ; Nicolics, Johann ; Weiss, Laurenz Reliability analysis of Cu wire bonds in microelectronic packagesKonferenzbeitrag Inproceedings2016
54Suhir, E. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit StressesKonferenzbeitrag Inproceedings2016
55Suhir, E. ; Yi, S. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. Semiconductor film grown on a circular substrate: predictive modeling of lattice-misfit stressesArtikel Article 2016
56Suhir, E. ; Ghaffarian, R. ; Nicolics, J. Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?Artikel Article 2016
57Suhir, E. ; Ghaffarian, R. ; Nicolics, J. Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package designArtikel Article 2016
58Suhir, E. ; Nicolics, J. Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal StressesArtikel Article 2016
59Suhir, Ephraim ; Ghaffarian, R. ; Nicolics, Johann Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the endsArtikel Article 2016
60Nemitz, W. ; Wenzl, F.-P. ; Schweitzer, S. ; Sommer, C. ; Hartmann, Paul ; Fulmek, Paul L. ; Nicolics, Johann A self-compensation approach for chromaticity coordinate maintenance of phosphor converted LEDs upon temperature variationsKonferenzbeitrag Inproceedings 2015