Title: Electro-thermo-mechanically coupled simulation of actively heated silicon chips
Language: English
Authors: Röcklinger, Matthias 
Qualification level: Diploma
Keywords: fully-coupled FE-simulations; polyheater
Advisor: Schmid, Ulrich 
Issue Date: 2020
Number of Pages: 53
Qualification level: Diploma
Abstract: 
In this thesis the current FEM simulation methodology regarding a polyheater, used as test device for thermo-mechanical reliability analysis of power metallizations, was investigated in order to verify its usage. In addition, the errors associated with various simplifications compared to a fully coupled simulation are estimated. Thermal simulations of the current FEM models were performed in order to demonstrate the significance of each distinct heat transfer method and its combinations. A simple 2D composition of thin films is constructed to see and learn how numerical contact mechanics work in our FEM development environment. Building upon this a 2D model of the 511 polyheater is assembled to simulate electrothermo-mechanical behaviour due to the voltage pulses of the measurements. Different approaches to simulate the full heat capacity of the 3D model in a 2D environment are conducted and compared with the focus on the different heat dissipation mechanisms. Uncoupled thermo-electrical simulations are compared to fully coupled electro-thermo-mechanical simulations. This comparison shows, that with the used material models and the perfectly smooth layers of the model, decoupled thermo-electrical simulations have a better cost-benefit ration than fully coupled electro-thermo-mechanical simulations.
URI: https://doi.org/10.34726/hss.2020.75140
http://hdl.handle.net/20.500.12708/14997
DOI: 10.34726/hss.2020.75140
Library ID: AC15612666
Organisation: E366 - Institut für Sensor- und Aktuatorsysteme 
Publication Type: Thesis
Hochschulschrift
Appears in Collections:Thesis

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