Record link: 
http://hdl.handle.net/20.500.12708/152896
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Title: 
Mechanical Reliability of Lead-Free Solder Joints: Comparative Study of Sn3.5Ag versus SnSbAg Solder Alloy
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Citation: 
Betzwar Kotas, A. M., Lederer, M., Khatibi Damavandi, G., Boczkal, G., & Perek-Nowak M. (2022). Mechanical Reliability of Lead-Free Solder Joints: Comparative Study of Sn3.5Ag versus SnSbAg Solder Alloy [Poster Presentation]. ISSE 2022, Austria.
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Publication Type: 
Presentation - Poster Presentation
en
Language: 
English
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Authors: 
Betzwar Kotas, Agnieszka Monika 
Lederer, Martin 
Khatibi Damavandi, Golta 
Boczkal, Grzegorz 
Perek-Nowak M. 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Date (published): 
2022
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Event name: 
ISSE 2022 
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Event date: 
11-May-2022 - 15-May-2022
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Event place: 
Austria
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Keywords: 
Reliability of Semiconductor Devices; Electronic packaging
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Research Areas: 
Materials Characterization: 30%
Sustainable Production and Technologies: 30%
Modeling and Simulation: 40%
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Science Branch: 
1040 - Chemie: 20%
1030 - Physik, Astronomie: 20%
2020 - Elektrotechnik, Elektronik, Informationstechnik: 60%
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Appears in Collections:
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