Record link: 
http://hdl.handle.net/20.500.12708/153150
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Title: 
Reliability Assessment of Thin Films and Multilayers in Electronic Packages
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Citation: 
Khatibi Damavandi, G. (2022, May 26). Reliability Assessment of Thin Films and Multilayers in Electronic Packages [Conference Presentation]. 48th International Conference on Metallurgical Coatings and Thin Films, ICMCTF, San Diego, CA, United States of America (the). http://hdl.handle.net/20.500.12708/153150
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Publication Type: 
Presentation - Conference Presentation
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Language: 
English
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Authors: 
Khatibi Damavandi, Golta 
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Organisational Unit: 
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit 
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Date (published): 
26-May-2022
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Event name: 
48th International Conference on Metallurgical Coatings and Thin Films, ICMCTF 
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Event date: 
22-May-2022 - 27-May-2022
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Event place: 
San Diego, CA, United States of America (the)
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Keywords: 
thin films; multilayers; electronic packages
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Research Areas: 
Materials Characterization: 30%
Surfaces and Interfaces: 50%
Modeling and Simulation: 20%
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Science Branch: 
1040 - Chemie: 60%
1030 - Physik, Astronomie: 20%
2020 - Elektrotechnik, Elektronik, Informationstechnik: 20%
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