Notice
This item was automatically migrated from a legacy system. It's data has not been checked and might not meet the quality criteria of the present system.
Record link: 
http://hdl.handle.net/20.500.12708/157608
-
Title: 
Advanced Thermal Management Solutions on PCBs for High-Power Applications
-
Citation: 
Langer, G., Leitgeb, M., Nicolics, J., Unger, M., Hoschopf, H., & Wenzl, F. P. (2014). Advanced Thermal Management Solutions on PCBs for High-Power Applications. Journal of Microelectronics and Electronic Packaging, 11(3), 104–114. https://doi.org/10.4071/imaps.422
-
Publisher DOI: 
10.4071/imaps.422
-
Publication Type: 
Article - Original Research Article
en
Authors: 
Langer, Gregor 
Leitgeb, Markus 
Nicolics, Johann 
Unger, Michael 
Hoschopf, Hans 
Wenzl, Franz P. 
-
Organisational Unit: 
E366-02 - Forschungsbereich Mikrosystemtechnik 
-
ISSN: 
0947-0808
-
Date (published): 
2014
-
Number of Pages: 
11
-
Peer reviewed: 
No
-
Keywords: 
Electrical and Electronic Engineering; Electronic, Optical and Magnetic Materials; Computer Networks and Communications
-
Research Areas: 
Sensor Systems: 100%
-
Science Branch: 
Elektrotechnik, Elektronik, Informationstechnik
-
Appears in Collections:
Article

Show full item record

Page view(s)

55
checked on Nov 19, 2023

Google ScholarTM

Check