Record link: 
https://doi.org/10.34726/hss.2023.101921
http://hdl.handle.net/20.500.12708/176595
-
Title: 
In-situ sputtering for advanced semiconductor wafer bonding with different ion species
en
Citation: 
Danner, M. B. (2023). In-situ sputtering for advanced semiconductor wafer bonding with different ion species [Diploma Thesis, Technische Universität Wien]. reposiTUm. https://doi.org/10.34726/hss.2023.101921
-
reposiTUm DOI: 
10.34726/hss.2023.101921
-
CatalogPlus: 
AC16824077
-
Publication Type: 
Thesis - Diplomarbeit
en
Language: 
English
-
Authors: 
Danner, Matthias Benedikt 
-
Advisor: 
Werner, Wolfgang 
-
Organisational Unit: 
E134 - Institut für Angewandte Physik 
-
Date (published): 
2023
-
Number of Pages: 
75
-
Keywords: 
Semiconductor; wafer bonding; ion sputtering; metrology
en
Additional information: 
Zusammenfassung in deutscher Sprache
Abweichender Titel nach Übersetzung der Verfasserin/des Verfassers
-
License: 
In Copyright
de
Appears in Collections:
Thesis

Fulltext (Version of Record (published version))
Adobe PDF
(11.07 MB)
In Copyright
Embargo. Accessible from 23.07.2025
Show full item record

Page view(s)

253
checked on Nov 22, 2023

Download(s)

13
checked on Nov 22, 2023

Google ScholarTM

Check